Plating apparatus and plating method

US9388504B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9388504-B2
Application numberUS-201414223972-A
CountryUS
Kind codeB2
Filing dateMar 24, 2014
Priority dateMar 26, 2013
Publication dateJul 12, 2016
Grant dateJul 12, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

First claim

Opening claim text (preview).

What is claimed is: 1. A plating apparatus, comprising: a processing bath configured to store a processing liquid therein; a substrate holder comprising a sealing member configured to hold a substrate with the sealing member, the sealing member configured to press the substrate and to seal at least a portion of the substrate from contacting the processing liquid; a transporter configured to immerse the substrate holder comprising the sealing member in the processing liquid stored in the processing bath, raise the substrate holder comprising the sealing member out of the processing bath, and transport the substrate holder comprising the sealing member in a horizontal direction; a suction mechanism configured to suck the processing liquid remaining on the substrate held by the substrate holder; and a moving mechanism configured to move the suction mechanism relative to the substrate holder, the suction mechanism being mounted to the moving mechanism, the moving mechanism being mounted to the transporter, and the transporter being configured to move the suction mechanism and the moving mechanism together with the substrate holder comprising the sealing member in the horizontal direction while transporting the substrate holder comprising the sealing member in the horizontal direction. 2. The plating apparatus according to claim 1 , wherein the moving mechanism includes an X-axis actuator configured to move the suction mechanism closer to and away from the substrate held by the substrate holder. 3. The plating apparatus according to claim 2 , wherein: the suction mechanism includes a first suction mechanism configured to suck the processing liquid remaining on the sealing member and the substrate, and a second suction mechanism configured to suck the processing liquid remaining on a surface of the substrate; and the X-axis actuator includes a first X-axis actuator configured to move the first suction mechanism closer to and away from the substrate held by the substrate holder, and a second X-axis actuator configured to move the second suction mechanism closer to and away from the substrate held by the substrate holder. 4. The plating apparatus according to claim 3 , wherein the moving mechanism further includes a Y-axis actuator configured to move the suction mechanism in the horizontal direction parallel to the substrate held by the substrate holder, and a Z-axis actuator configured to move the suction mechanism in a vertical direction. 5. The plating apparatus according to claim 4 , wherein each of the Y-axis actuator and the Z-axis actuator comprises an electric actuator capable of moving the suction mechanism along a preset path. 6. The plating apparatus according to claim 3 , wherein the first suction mechanism includes a single suction nozzle.

Assignees

Inventors

Classifications

  • Specific elements or parts of the apparatus · CPC title

  • Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

  • Removal of gases or vapours {; Gas or pressure control} · CPC title

  • Cleaning devices (adaptations of roller sleeves for cleaning belts B65G39/073) · CPC title

  • Process conditions · CPC title

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Frequently asked questions

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What does patent US9388504B2 cover?
A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the s…
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification C25D17/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).