Method for deposition of conformal films with catalysis assisted low temperature CVD

US9388491B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9388491-B2
Application numberUS-201313946012-A
CountryUS
Kind codeB2
Filing dateJul 19, 2013
Priority dateJul 23, 2012
Publication dateJul 12, 2016
Grant dateJul 12, 2016

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A method for depositing a film in a substrate processing system includes arranging a substrate on a pedestal in a processing chamber, heating the substrate to a temperature within a predetermined temperature range, and supplying a gas mixture to the processing chamber for a predetermined period to deposit the film on the substrate, wherein the gas mixture includes a first precursor gas, ammonia gas and diborane gas.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for depositing a conformal film in a substrate processing system, comprising: a) arranging a substrate on a pedestal in a processing chamber; b) heating the substrate to a temperature within a predetermined temperature range, wherein the predetermined temperature range is between 500° C. and 630° C.; and c) supplying a gas mixture to the processing chamber for a predetermined period to deposit the conformal film on the substrate, wherein the gas mixture includes a first precursor gas, ammonia gas and diborane gas, wherein the first precursor gas has a deposition temperature of approximately 650° C., wherein the gas mixture including the diborane gas has a deposition temperature within the predetermined temperature range, and wherein a ratio of the first precursor gas to the diborane gas is between 1:0.01 and 1:0.025. 2. The method of claim 1 , further comprising: d) purging the gas mixture after the predetermined period; and e) repeating a) to d) one or more times. 3. The method of claim 1 , wherein the conformal film includes one of a boron nitride film, a silicon nitride film, and a boron carbide film. 4. The method of claim 1 , wherein the first precursor gas includes silane. 5. The method of claim 1 , further comprising toggling the diborane gas on and off multiple times during the predetermined period.

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What does patent US9388491B2 cover?
A method for depositing a film in a substrate processing system includes arranging a substrate on a pedestal in a processing chamber, heating the substrate to a temperature within a predetermined temperature range, and supplying a gas mixture to the processing chamber for a predetermined period to deposit the film on the substrate, wherein the gas mixture includes a first precursor gas, ammonia…
Who is the assignee on this patent?
Novellus Systems Inc
What technology area does this patent fall under?
Primary CPC classification C23C16/38. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).