Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition

Patent metadata

Field	Value
Publication number	US-9387608-B2
Application number	US-51518207-A
Country	US
Kind code	B2
Filing date	Nov 14, 2007
Priority date	Nov 15, 2006
Publication date	Jul 12, 2016
Grant date	Jul 12, 2016

Abstract

This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

First claim

The invention claimed is:

1. A thermosetting resin composition for light reflection, comprising a thermosetting component and a white pigment (E), wherein:
the thermosetting resin composition has a property of light reflectance at a wavelength of 350 nm to 800 nm, after thermal curing, which is not lower than 80%, and wherein:
the thermosetting component contains an epoxy resin (A) and a curing agent (B) containing an acid anhydride;
said white pigment (E) includes a mixture of inorganic hollow particles and at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, and zirconium oxide; and
wherein the inorganic hollow particles are made of at least one selected from the group consisting of sodium silicate glass, aluminosilicate glass, sodium borosilicate soda glass and Shirasu glass;
the thermosetting resin composition comprises a kneaded product obtained under a condition where constituent components are kneaded at a kneading temperature of 20 to 100° C. for a kneading time of 10 to 30 minutes; and
said kneaded product is aged at 0 to 30° C. for 1 to 72 hours after the kneading.

2. The thermosetting resin composition for light reflection according to claim 1 , further containing a thickener (H), wherein the thickener (H) contains a nanoparticle filler having a median particle size of 1 nm to 1000 nm.

3. The thermosetting resin composition for light reflection according to claim 1 , further containing an inorganic filler (D), wherein the inorganic filler (D) contains a porous filler or a compound having oil absorption capacity.

4. The thermosetting resin composition for light reflection according to claim 3 , wherein the shape of said porous filler or compound having oil absorption capacity is at least one selected from the group consisting of a perfect spherical shape, an irregular shape, a disc-like shape, a rod shape and a fibrous shape.

5. The thermosetting resin composition for light reflection according to claim 3 , wherein a surface of said porous filler or compound having oil absorption capacity is subjected to a hydrophobization treatment or a hydrophilization treatment.

6. The thermosetting resin composition for light reflection according to claim 3 , wherein the apparent density of said porous filler or compound having oil absorption capacity is not lower than 0.4 g/cm 3 .

7. The thermosetting resin composition for light reflection according to claim 3 , wherein the content of said porous filler or compound having oil absorption capacity in said inorganic filler (D) ranges from 0.1 vol % to 20 vol %.

8. The thermosetting resin composition for light reflection according to claim 3 , further containing as said inorganic filler (D), at least one selected from the group consisting of silica, aluminum hydroxide, magnesium hydroxide, barium sulfate, magnesium carbonate and barium carbonate.

9. The thermosetting resin composition for light reflection according to claim 1 , wherein the median particle size of said white pigment (E) ranges from 0.1 to 50 μm.

10. The thermosetting resin composition for light reflection according to claim 3 , wherein the total blending amount of said inorganic filler (D) and said white pigment (E) ranges from 10 vol % to 85 vol % relative to total resin composition.

11. The thermosetting resin composition for light reflection according to claim 1 , wherein said light reflectance at a wavelength of 350 nm to 800 nm, after thermal curing, is not lower than 90%.

12. The thermosetting resin composition for light reflection according to claim 1 , which is capable of being pressure molded at a temperature in the range of 0° C. to 30° C. prior to thermal curing.

13. The thermosetting resin composition for light reflection according to claim 1 , further including an inorganic filler (D).

14. The thermosetting resin composition for light reflection according to claim 13 , wherein a total blending amount of the inorganic filler (D) and the white pigment (E) ranges from 10 vol % to 85 vol % relative to total resin composition.

15. The thermosetting resin composition for light reflection according to claim 1 , wherein said curing agent (B) contains hexahydrophthalic anhydride.

16. The thermosetting resin composition for light reflection according to claim 1 , wherein the epoxy resin (A) contains at least one selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, diglycidyl isocyanurate and triglycidyl isocyanurate.

17. The thermosetting resin composition for light reflection according to claim 1 , wherein the curing agent (B) contains at least one selected from the group consisting of phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic dianhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride, dimethylglutaric anhydride, diethylglutaric anhydride, succinic anhydride, methylhexahydrophthalic anhydride and methyltetrahydrophthalic anhydride.

18. The thermosetting resin composition for light reflection according to claim 1 , wherein said white pigment (E) includes a mixture of inorganic hollow particles, alumina and at least one selected from the group consisting of magnesium oxide, antimony oxide, titanium oxide and zirconium oxide.

19. The thermosetting resin composition for light reflection according to claim 1 , wherein a blending amount of the white pigment (E) is 10 vol % to 85 vol % relative to the total thermosetting resin composition.

20. The thermosetting resin composition for light reflection according to claim 1 , wherein said kneading is a melt kneading.

Assignees

• Kotani Hayato
• Urasaki Naoyuki
• Yuasa Kanako
• Nagai Akira
• Hamada Mitsuyoshi
• Hitachi Chemical Co Ltd

Inventors

• Kotani Hayato
• Urasaki Naoyuki
• Yuasa Kanako
• Nagai Akira
• Hamada Mitsuyoshi

Classifications

• B29C45/02 Primary

  Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title

• C08K3/2279

  of antimony · CPC title

• C08K2003/2244

  of zirconium · CPC title

• C08K2003/222

  Magnesia, i.e. magnesium oxide · CPC title