High breakdown N-type buried layer

Patent metadata

Field	Value
Publication number	US-9385187-B2
Application number	US-201414555330-A
Country	US
Kind code	B2
Filing date	Nov 26, 2014
Priority date	Apr 25, 2014
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

A semiconductor device has an n-type buried layer formed by implanting antimony and/or arsenic into the p-type first epitaxial layer at a high dose and low energy, and implanting phosphorus at a low dose and high energy. A thermal drive process diffuses and activates both the heavy dopants and the phosphorus. The antimony and arsenic do not diffuse significantly, maintaining a narrow profile for a main layer of the buried layer. The phosphorus diffuses to provide a lightly-doped layer several microns thick below the main layer. An epitaxial p-type layer is grown over the buried layer.

First claim

What is claimed is:

1. A method of forming a semiconductor device, comprising the steps:
providing a first epitaxial layer of a substrate comprising p-type semiconductor material;
implanting first n-type dopants into the substrate at a first dose to form a first implantation layer;
implanting second n-type dopants into the substrate at a second dose less than the first dose and at an energy above 100 keV to form a second implementation layer; and
heating the substrate in a first thermal drive process at a temperature of 1150° C. to 1225° C. for at least 30 minutes to define a p-type epitaxial layer in the substrate and form an n-type buried layer positioned above the p-type epitaxial layer, the n-type buried layer including:
a main layer having a first doping concentration and a buried top surface below a top surface of the substrate; and
a lightly-doped layer positioned above the p-type epitaxial layer and below the main layer, the lightly-doped layer having a second doping concentration lower than the first doping concentration.

2. The method of claim 1 , wherein the p-type semiconductor material in the first p-type epitaxial layer has a resistivity of 5 ohm-cm to 10 ohm-cm.

3. The method of claim 1 , wherein the first n-type dopants include antimony and are implanted at the first dose greater than 5×10 14 cm −2 .

4. The method of claim 1 , wherein the first n-type dopants include phosphorus and are implanted into across the substrate.

5. The method of claim 1 , wherein the first n-type dopants include phosphorus and are implanted into the substrate through areas exposed by an implant mask so that the n-type buried layer includes a localized n-type buried layer.

6. The method of claim 1 , further comprising heating the substrate in a second thermal drive process at a second temperature of 1125° C. to 1200° C. for at least 120 minutes after the first p-type epitaxial layer is defined.

7. The method of claim 1 , further comprising forming a deep trench in the substrate extending from the top surface of the substrate through the n-type buried layer to reach the first p-type epitaxial layer without penetrating through the substrate, and forming a dielectric liner coating a bottom portion of the deep trench and contacting the substrate.

8. The method of claim 7 , wherein the deep trench has a closed-loop configuration defined on the top surface of the substrate.

9. The method of claim 7 , further comprising implanting third n-type dopants into the substrate adjacent to the deep trench after the deep trench is formed so as to form n-type self-aligned sinkers in the substrate to abutting the buried top surface of the n-type buried layer.

10. The method of claim 1 , further comprising forming an n-type sinker in the substrate extending to the buried top surface of the n-type buried layer, the n-type sinker having a closed-loop configuration.

Assignees

• Texas Instruments Inc

Inventors

• Pendharkar Sameer P
• Hu Binghua
• Edwards Henry Litzmann

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P32/1406

  by ion implantation · CPC title

• H10P32/171

  being group IV material · CPC title

• H10P30/212

  Through-implantation · CPC title

• H10P30/204

  into Group IV semiconductors · CPC title