Semiconductor memory device
US-2015364607-A1 · Dec 17, 2015 · US
US9385128B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9385128-B2 |
| Application number | US-201414297668-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2014 |
| Priority date | Mar 18, 2011 |
| Publication date | Jul 5, 2016 |
| Grant date | Jul 5, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A selection operation is performed for individual memory cells. A device includes a first memory cell and a second memory cell provided in the same row as the first memory cell, each of which includes a field-effect transistor having a first gate and a second gate. The field-effect transistor controls at least data writing and data holding in the memory cell by being turned on or off. The device further includes a row selection line electrically connected to the first gates of the field-effect transistors included in the first memory cell and the second memory cell, a first column selection line electrically connected to the second gate of the field-effect transistor included in the first memory cell, and a second column selection line electrically connected to the second gate of the field-effect transistor included in the second memory cell.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a first line; a second line; a third line; and a first transistor and a second transistor each including a first gate, a second gate, a source, a drain, and a semiconductor layer, wherein the semiconductor layer of the first transistor is positioned between the first gate of the first transistor and the second gate of the first transistor, wherein the semiconductor layer of the second transistor is positioned between the first gate of the second transistor and the second gate of the second transistor, wherein the first gate of the first transistor is electrically connected to the first line, wherein the second gate of the first transistor is electrically connected to the second line, wherein one of the source and the drain of the first transistor is electrically connected to the third line, wherein one of the source and the drain of the second transistor is electrically connected to the third line, and wherein the other of the source and the drain of the first transistor is electrically connected to the second gate of the second transistor. 2. The semiconductor device according to claim 1 , further comprising a fourth line electrically connected to the other of the source and the drain of the second transistor. 3. The semiconductor device according to claim 1 , wherein a material of the semiconductor layer of the first transistor is the same as a material of the semiconductor layer of the second transistor. 4. The semiconductor device according to claim 1 , wherein the semiconductor layer of the second transistor includes an oxide semiconductor. 5. The semiconductor device according to claim 1 , further comprising: a fourth line; a fifth line; and a third transistor and a fourth transistor each including a first gate, a second gate, a source, a drain, and a semiconductor layer, wherein the semiconductor layer of the third transistor is positioned between the first gate of the third transistor and the second gate of the third transistor, wherein the semiconductor layer of the fourth transistor is positioned between the first gate of the fourth transistor and the second gate of the fourth transistor, wherein the first gate of the third transistor is electrically connected to the first line, wherein the second gate of the third transistor is electrically connected to the fourth line, wherein one of the source and the drain of the third transistor is electrically connected to the fifth line, wherein one of the source and the drain of the fourth transistor is electrically connected to the fifth line, and wherein the other of the source and the drain of the third transistor is electrically connected to the second gate of the fourth transistor. 6. The semiconductor device according to claim 5 , further comprising a sixth line electrically connected to the other of the source and the drain of the second transistor and the other of the source and the drain of the fourth transistor. 7. A semiconductor device comprising: a first line; a second line; a third line; and a first transistor and a second transistor each including a first gate, a second gate, a source, a drain, and a semiconductor layer, wherein the semiconductor layer of the first transistor is positioned between the first gate of the first transistor and the second gate of the first transistor, wherein the semiconductor layer of the second transistor is positioned between the first gate of the second transistor and the second gate of the second transistor, wherein the first gate of the first transistor is electrically connected to the first line, wherein the second gate of the first transistor is electrically connected to the second line, wherein one of the source and the drain of the first transistor is electrically connected to the third line, wherein one of the source and the drain of the second transistor is electrically connected to the third line and the first gate of the second transistor, and wherein the other of the source and the drain of the first transistor is electrically connected to the second gate of the second transistor. 8. The semiconductor device according to claim 7 , further comprising a fourth line electrically connected to the other of the source and the drain of the second transistor. 9. The semiconductor device according to claim 7 , wherein a material of the semiconductor layer of the first transistor is the same as a material of the semiconductor layer of the second transistor. 10. The semiconductor device according to claim 7 , wherein the semiconductor layer of the second transistor includes an oxide semiconductor. 11. The semiconductor device according to claim 7 , further comprising: a fourth line; a fifth line; and a third transistor and a fourth transistor each including a first gate, a second gate, a source, a drain, and a semiconductor layer, wherein the semiconductor layer of the third transistor is positioned between the first gate of the third transistor and the second gate of the third transistor, wherein the semiconductor layer of the fourth transistor is positioned between the first gate of the fourth transistor and the second gate of the fourth transistor, wherein the first gate of the third transistor is electrically connected to the first line, wherein the second gate of the third transistor is electrically connected to the fourth line, wherein one of the source and the drain of the third transistor is electrically connected to the fifth line, wherein one of the source and the drain of the fourth transistor is electrically connected to the fifth line and the first gate of the fourth transistor, and wherein the other of the source and the drain of the third transistor is electrically connected to the second gate of the fourth transistor. 12. The semiconductor device according to claim 11 , further comprising a sixth line electrically connected to the other of the source and the drain of the second transistor and the other of the source and the drain of the fourth transistor. 13. A semiconductor device comprising: a first line; a second line; a third line; a first transistor and a second transistor each including a first gate, a second gate, a source, a drain, and a semiconductor layer; and a first capacitor, wherein the semiconductor layer of the first transistor is positioned between the first gate of the first transistor and the second gate of the first transistor, wherein the semiconductor layer of the second transistor is positioned between the first gate of the second transistor and the second gate of the second transistor, wherein the first gate of the first transistor is electrically connected to the first line, wherein the second gate of the first transistor is electrically connected to the second line, wherein one of the source and the drain of the first transistor is electrically connected to the third line, wherein one of the source and the drain of the second transistor is electrically connected to the third line, and wherein the other of the source and the drain of the first transistor is electrically connected to the second gate of the second transistor and the first capacitor. 14. The semiconductor device according to claim 13 , further comprising a fourth line electrically connected to the other of the source and the drain of the second transistor. 15. The semiconductor device according to claim 13 , wherein a material of the semiconductor layer of the first transistor is the same as a material of the semiconductor layer of the second transistor. 16.
Combinations of field-effect devices and one or more diodes, capacitors or resistors · CPC title
with one charge-transfer gate, e.g. MOS transistor, per cell · CPC title
with three charge-transfer gates, e.g. MOS transistors, per cell · CPC title
Decoders · CPC title
Layouts of interconnections · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.