Heat flux gauge with micro-scale temperature sensors

US9377370B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9377370-B2
Application numberUS-201213409014-A
CountryUS
Kind codeB2
Filing dateFeb 29, 2012
Priority dateFeb 29, 2012
Publication dateJun 28, 2016
Grant dateJun 28, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for measuring temperature parameters of a structure is provided. The apparatus comprises: a carrier including at least one receiving portion; and a plurality of temperature sensors disposed within the at least one receiving portion and secured to the receiving portion via a bonding medium, the sensors being distributed along at least one direction of the carrier and configured to measure and record temperature information through microstructural changes corresponding to temperatures experienced by the respective sensors.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for measuring temperature parameters of an engine component, comprising: a carrier removably disposed within a hole formed in the engine component, the carrier including at least one receiving portion; and a plurality of temperature sensors, disposed within and secured to the at least one receiving portion via a bonding medium, the temperature sensors being distributed along at least one direction of the carrier, wherein the carrier is oriented with respect to the engine component so that the direction of the carrier corresponds to a direction of heat transfer through the engine component, and the temperature sensors are configured to measure and record temperature information along the direction of heat transfer based on microstructural changes corresponding to temperatures experienced by the respective temperature sensors, and wherein the at least one receiving portion includes two receiving portions disposed within surfaces of the carrier at opposite ends of the carrier, and the temperature sensors and the bonding medium form a flush surface with the respective surfaces of the carrier. 2. The apparatus of claim 1 , wherein the at least one receiving portion includes a plurality of receiving portions disposed in the respective surfaces of the carrier, and each of the temperature sensors is disposed within one of the plurality of receiving portions. 3. The apparatus of claim 1 , wherein one of the plurality of temperature sensors is disposed substantially in a middle section of the carrier between the opposite ends of the carrier. 4. The apparatus of claim 1 , wherein the carrier has a cylindrical shape. 5. The apparatus of claim 1 , wherein: the carrier has a cubical shape; and the temperature sensors are disposed substantially close to respective vertices of the carrier. 6. The apparatus of claim 1 , wherein: the carrier has a spherical shape; at least one of the temperature sensors is disposed substantially at a center of the carrier; and at least two of the temperature sensors are disposed substantially at opposite poles of the carrier. 7. The apparatus of claim 1 , wherein: the carrier has a plug shape including a first cylindrical portion and a second cylindrical portion connected together in series; and a radial dimension of the first cylindrical portion is greater than a radial dimension of the second cylindrical portion. 8. The apparatus of claim 1 , wherein the bonding medium includes a water-soluble adhesive. 9. The apparatus of claim 1 , wherein: the temperature sensors include at least one Izmeritel Maximalnoi Temperaturi Kristalicheskii (IMTK) crystal sensor, the temperature sensors being configured to record a maximum temperature experienced by the temperature sensors and wirelessly communicate the maximum temperature to a detector by emitting electromagnetic signals; and the carrier is made of a metal or a metal alloy. 10. The apparatus of claim 1 , wherein each of the temperature sensors has a dimension less than 1.0 mm. 11. The apparatus of claim 1 , wherein the temperature information along the direction of heat transfer is obtained from the temperature sensors after the carrier is removed from the engine component and the temperature sensors are removed from the carrier. 12. The apparatus of claim 11 , wherein the temperature sensors are removed from the carrier by a water solvent. 13. The apparatus of claim 1 , wherein the carrier has a first dimension that is substantially equal to a dimension of the engine component. 14. The apparatus of claim 13 , wherein the first dimension of the carrier is substantially equal to a thickness of the engine component. 15. The apparatus of claim 13 , wherein the carrier has a second dimension that is less than or equal to about 6 mm.

Assignees

Inventors

Classifications

  • G01K17/00Primary

    Measuring quantity of heat (measuring temperature by calorimetry G01K3/00 - G01K11/00; specially adapted for measuring thermal properties of materials, e.g. specific heat, heat of combustion G01N) · CPC title

  • in respect of time · CPC title

  • using melting, freezing, or softening · CPC title

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What does patent US9377370B2 cover?
An apparatus for measuring temperature parameters of a structure is provided. The apparatus comprises: a carrier including at least one receiving portion; and a plurality of temperature sensors disposed within the at least one receiving portion and secured to the receiving portion via a bonding medium, the sensors being distributed along at least one direction of the carrier and configured to m…
Who is the assignee on this patent?
Kim Yong Weon, Arellano Leonel Ochoa, Solar Turbines Inc
What technology area does this patent fall under?
Primary CPC classification G01K17/00. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).