Light sensor with chemically resistant and robust reflector stack

Patent metadata

Field	Value
Publication number	US-9377350-B2
Application number	US-201514827112-A
Country	US
Kind code	B2
Filing date	Aug 14, 2015
Priority date	Sep 4, 2014
Publication date	Jun 28, 2016
Grant date	Jun 28, 2016

Abstract

A light sensor having a chemically resistant and robust reflector stack is disclosed. The reflector stack is formed over a substrate, and includes an adhesion layer, a patterned reflector layer over the adhesion layer, and a smoothing layer over the patterned reflector layer. The patterned reflector layer has a substantially flat top surface. A conformal passivation layer covers the reflector stack. An absorbing layer is situated above the reflector stack and separated from the reflector stack. The absorbing layer is supported by vias over the substrate. The absorbing layer is connected to at least one resistor, where a resistance of the at least one resistor varies in response to light absorbed by the absorbing layer. The vias are disposed on via landing pads on the substrate.

First claim

The invention claimed is:

1. A light sensor comprising:
a reflector stack over a substrate, said reflector stack having an adhesion layer, a patterned reflector layer over said adhesion layer, and a smoothing layer over said patterned reflector layer;
a conformal passivation layer covering said reflector stack;
an absorbing layer above said reflector stack and separated from said reflector stack.

2. The light sensor of claim 1 , wherein said absorbing layer is separated from said reflector stack by a void.

3. The light sensor of claim 1 , wherein said absorbing layer is separated from said reflector stack by a sacrificial layer.

4. The light sensor of claim 1 , wherein said absorbing layer is supported by vias over said substrate.

5. The light sensor of claim 1 , wherein said absorbing layer is connected to at least one resistor, wherein a resistance of said at least one resistor varies in response to light absorbed by said absorbing layer.

6. The light sensor of claim 1 , wherein said adhesion layer comprises titanium (Ti) and/or titanium nitride (TiN).

7. The light sensor of claim 1 , wherein said smoothing layer comprises Ti and/or TiN.

8. The light sensor of claim 1 , wherein said patterned reflector layer comprises aluminum (Al).

9. The light sensor of claim 1 , wherein said conformal passivation layer comprises silicon oxide.

10. The light sensor of claim 4 , wherein said vias are disposed on via landing pads on said substrate.

11. The light sensor of claim 1 , wherein said patterned reflector layer includes a substantially flat top surface.

12. The light sensor of claim 1 , wherein said light sensor comprises an infrared sensor.

13. A method of fabricating a light sensor comprising:
forming an adhesion layer over a substrate;
forming a reflector metal layer over said adhesion layer;
forming a smoothing layer over said reflector metal layer;
patterning said adhesion layer, said reflector metal layer, and said smoothing layer to form a reflector stack;
forming a conformal passivation layer covering said reflector stack;
forming an absorbing layer above said reflector stack and separated from said reflector stack.

14. The method of claim 13 , further comprising forming a sacrificial layer over said conformal passivation layer.

15. The method of claim 14 , further comprising forming vias over said substrate, said vias extending through said sacrificial layer and landing on respective via landing pads on said substrate.

16. The method of claim 14 , further comprising forming at least one resistor connected to said absorbing layer over said sacrificial layer, wherein a resistance of said at least one resistor varies in response to light absorbed by said absorbing layer.

17. The method of claim 14 , further comprising removing said sacrificial layer to form a void between said absorbing layer and said reflector stack.

18. The method of claim 13 , wherein said conformal passivation layer covers sidewalls of said reflector stack.

19. The method of claim 13 , wherein said patterning of said adhesion layer, said reflector metal layer, and said smoothing layer forms via landing pads on said substrate.

20. The method of claim 13 , further comprising chemical mechanical polishing (CMP) said reflector metal layer to form a substantially flat top surface.

Assignees

• Newport Fab Llc

Inventors

• Howard David J
• Rose Jeff
• Kar-Roy Arjun
• Debar Michael J

Classifications

• G01J1/0414 Primary

  using plane or convex mirrors, parallel phase plates, or plane beam-splitters · CPC title

• G01J5/0225 Primary

  Shape of the cavity itself or of elements contained in or suspended over the cavity · CPC title

• G01J5/024

  Special manufacturing steps or sacrificial layers or layer structures · CPC title

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title