Temperature-stabilized storage systems with regulated cooling

Patent metadata

Field	Value
Publication number	US-9372016-B2
Application number	US-201313906909-A
Country	US
Kind code	B2
Filing date	May 31, 2013
Priority date	May 31, 2013
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

Regulated cooling devices are described herein that are sized, shaped and calibrated for use with a substantially thermally sealed storage container. In some embodiments, the regulated cooling devices include a cooling region, an adiabatic region, a lid region, and an electronics unit attached to the lid region.

First claim

What is claimed is:

1. A regulated cooling device comprising:
a cooling region including
an outer wall with an inner surface and an outer surface,
at least one temperature sensor positioned adjacent to the outer surface of the outer wall, and
a first region of thermal heat pipe positioned within the outer wall substantially parallel to the inner surface, the first region of the thermal heat pipe including a first end with a heat-absorbing interface;

an adiabatic region including
an insulation unit, the insulation unit including an outer surface of a size and shape to reversibly mate with a surface of an access conduit within a substantially thermally sealed storage container, the insulation unit including an inner surface of a size and shape to reversibly mate with an outer surface of the thermal heat pipe, and
a second region of the thermal heat pipe positioned adjacent to the inner surface of the insulation unit;

a lid region including
a third region of the thermal heat pipe, the third region including a second end with a heat-releasing interface,
a thermoelectric unit in contact with the second end of the thermal heat pipe, and
a thermal dissipator unit in contact with the thermoelectric unit; and

an electronics unit attached to the lid region, including
a microcontroller connected to the at least one temperature sensor, to the thermoelectric unit and to the thermal dissipator unit, and
an power source attached to the microcontroller.

2. The regulated cooling device of claim 1 , wherein the thermal heat pipe is substantially linear.

3. The regulated cooling device of claim 1 , wherein the thermal heat pipe comprises:
a textured external surface.

4. The regulated cooling device of claim 1 , wherein the cooling region comprises:
a phase change material-retaining unit with an outer boundary substantially formed by the outer wall; and
a phase change material within the phase change material-retaining unit.

5. The regulated cooling device of claim 1 , wherein the cooling region comprises:
a plurality of temperature sensors positioned adjacent to the outer surface of the outer wall; and
a connector between the temperature sensors and the microcontroller of the electronics unit.

6. The regulated cooling device of claim 1 , wherein the first region of the thermal heat pipe has an outer surface, the outer surface positioned substantially parallel to the inner surface of the outer wall of the cooling region, with a phase change material-impermeable gap between the outer surface of the heat pipe and the inner surface of the outer wall of the cooling region.

7. The regulated cooling device of claim 1 , wherein the cooling region comprises:
an end cap, the end cap attached to the outer surface of the outer wall and aligned with the first end of the thermal heat pipe.

8. The regulated cooling device of claim 1 , wherein the largest cross-section diameter of the cooling region is less than the diameter of the outer surface of the insulation unit.

9. The regulated cooling device of claim 1 , wherein the adiabatic region comprises:
a wire conduit within the insulation unit, the wire conduit including an internal surface configured to mate with an outer surface of a wire.

10. The regulated cooling device of claim 1 , wherein the adiabatic region comprises:
a medicinal storage cup attached to the insulation unit at a region of the insulation unit proximal to the cooling region.

11. The regulated cooling device of claim 1 , wherein the lid region comprises:
a surface configured to reversibly mate with an external surface of a substantially thermally sealed storage container.

12. The regulated cooling device of claim 1 , wherein the first region of the thermal heat pipe, the second region of the thermal heat pipe, and the third region of the thermal heat pipe are substantially linear.

13. The regulated cooling device of claim 1 , wherein the first region of the thermal heat pipe is configured to operate while positioned below the second region of the thermal heat pipe.

14. The regulated cooling device of claim 1 , comprising:
a user interface attached to the electronics unit.

15. The regulated cooling device of claim 1 , comprising:
a stabilizer unit attached to a first end of the insulation unit and to the outer surface of the outer wall of the cooling region at a position distal to the first end of the thermal heat pipe.

16. A regulated cooling device comprising:
a thermal heat pipe including a first end with a heat-absorbing interface, and a second end with a heat-releasing interface;
an outer wall surrounding the first end of the heat pipe, the outer wall including an inner surface and an outer surface, the outer wall forming a phase change material-impermeable gap around the first end of the heat pipe;
an end cap, the end cap sealed to an edge of the outer wall distal to the first end of the heat pipe;
a phase change material within the phase change material-impermeable gap around the first end of the heat pipe;
at least one temperature sensor positioned adjacent to the outer wall;
an insulation unit surrounding the heat pipe at a region between the first end and the second end, the insulation unit including an outer surface of a size and shape to reversibly mate with a surface of an access conduit within a substantially thermally sealed storage container, the insulation unit including an inner surface of a size and shape to reversibly mate with an outer surface of the thermal heat pipe at the region between the first end and the second end;
a thermoelectric unit in contact with the second end of the thermal heat pipe;
a thermal dissipator unit in contact with the thermoelectric unit;
a microcontroller connected to the at least one temperature sensor, to the thermoelectric unit and to the thermal dissipator unit; and
an power source attached to the microcontroller.

17. The regulated cooling device of claim 16 , wherein the thermal heat pipe is substantially linear.

18. The regulated cooling device of claim 16 , wherein the outer wall surrounding the first end of the heat pipe is substantially transparent.

19. The regulated cooling device of claim 16 , wherein the outer wall is fabricated from a polycarbonate plastic material.

20. The regulated cooling device of claim 16 , wherein the inner surface of the outer wall surrounding the first end of the heat pipe is a textured surface.

21. The regulated cooling device of claim 16 , wherein the external diameter of the outer wall surrounding the first end of the heat pipe is smaller than the external diameter of the outer surface of the insulation unit.

22. The regulated cooling device of claim 16 , wherein the insulation unit comprises:
a wire conduit within the insulation unit, the wire conduit including an internal surface configured to mate with an outer surface of a wire.

23. The regulated cooling device of claim 16 , comprising:
a plurality of temperature sensors positioned adjacent to the outer surface of the outer wall surrounding the first end of the heat pipe; and
a connector between the plurality of temperature sensors and the microcontroller.

24. The regulated cooling device of claim 16 , comprising:
a lid enclosure surrounding the thermal dissipator unit and the microcontroller, the lid enclosure including at least one first wall including a plurality of apertures, the lid enclosure including at least one second wall with an e

Assignees

• Tokitae Llc

Inventors

• Bloedow Jonathan
• Calderon Ryan
• Gasperino David
• Gates William
• Hyde Roderick A
• Jung Edward K Y
• Liu Shieng
• Myhrvold Nathan P
• Pegram Nathan John
• Tegreene Clarence T
• Whitmer Charles
• Wood Jr Lowell L
• Yildirim Ozgur Emek

Classifications

• F25B21/02 Primary

  using Peltier effect; using Nernst-Ettinghausen effect · CPC title

• F25D2201/14

  using subatmospheric pressure · CPC title

• F25D3/06

  Movable containers · CPC title