Method and apparatus for reducing post-cure extraction force of a tooling mandrel
US-2016368174-A1 · Dec 22, 2016 · US
Resin molding apparatus and resin molding method
US9370879B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9370879-B2 |
| Application number | US-201214124151-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 7, 2012 |
| Priority date | Jun 8, 2011 |
| Publication date | Jun 21, 2016 |
| Grant date | Jun 21, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A lens molding apparatus of the present invention includes: a mold having a transfer surface for transferring a predetermined lens shape to a dielectric resin; a mold having a transfer surface for transferring a predetermined lens shape to the dielectric resin; a support device moving the mold; a heating device heating the dielectric resin so as to form a resin molded product, the dielectric resin having been supplied on the transfer surface; a DC power source forming an electric field by application of direct-current voltage between the mold and the mold; and switches switching a direction of the electric field between a direction from the mold to the mold and a direction from the mold to the mold.
First claim
Opening claim text (preview).
The invention claimed is: 1. A resin molding method comprising the steps of: (a) curing a dielectric resin material so as to form a resin molded product while a second transfer surface of a second mold is being pressed against the dielectric resin material, the dielectric resin material having been supplied on a first transfer surface of a first mold; and (b) separating the second transfer surface from the resin molded product, the step (a) including the sub-step of forming an electric field in a predetermined direction by application of direct-current voltage between the first mold and the second mold, the step (b) including the sub-step of forming an electric field in a direction that is opposite to the predetermined direction between the first mold and the second mold. 2. A resin molding method comprising the steps of: (a) curing a dielectric resin material so as to form a resin molded product while a transfer surface of a mold is being pressed against the dielectric resin material, the dielectric resin material having been supplied on a base plate; and (b) separating the transfer surface from the resin molded product, the step (a) including the sub-step of forming an electric field in a predetermined direction by application of direct-current voltage between the base plate and the mold, the step (b) including the sub-step of forming an electric field in a direction that is opposite to the predetermined direction between the base plate and the mold. 3. The resin molding method as set forth in claim 1 , wherein the resin molded product is one or more lenses.
Assignees
Inventors
Classifications
- B29C33/44Primary
with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles · CPC title
Applying vibrations to the mould parts · CPC title
characterised by the shape of the surface · CPC title
Auxiliary operations, e.g. machines for filling the moulds (B29D11/00125 takes precedence) · CPC title
Compression moulding under special conditions, e.g. vacuum · CPC title
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- What does patent US9370879B2 cover?
- A lens molding apparatus of the present invention includes: a mold having a transfer surface for transferring a predetermined lens shape to a dielectric resin; a mold having a transfer surface for transferring a predetermined lens shape to the dielectric resin; a support device moving the mold; a heating device heating the dielectric resin so as to form a resin molded product, the dielectric re…
- Who is the assignee on this patent?
- Nakahashi Takahiro, Hanato Hiroyuki, Sharp Kk
- What technology area does this patent fall under?
- Primary CPC classification B29C33/44. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jun 21 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).