Imprinting method

Patent metadata

Field	Value
Publication number	US-9370875-B2
Application number	US-201213585970-A
Country	US
Kind code	B2
Filing date	Aug 15, 2012
Priority date	Feb 16, 2010
Publication date	Jun 21, 2016
Grant date	Jun 21, 2016

Abstract

An imprinting method is capable of separating a molding material and a target material rapidly in pattern formation. The imprinting method includes a transferring process for transferring an inverted pattern of a mold 10 having a desired pattern formed thereon to a resist 30 by pressing the mold 10 against the resist 30 ; a curing process for curing the resist 30 by heating or irradiating light; and a separating process for separating the mold 10 from the resist 30 after the resist 30 is cured through the transferring process. The separating process includes a pulling process for pulling the mold 10 away from the resist 30 in a direction opposite to a direction in which the resist 30 is pressed; and a pushing process for pushing the resist 30 in the same direction as a direction in which the mold 10 presses the resist 30.

First claim

What is claimed is:

1. An imprinting method comprising:
a pressing process for pressing a molding material having thereon a pattern against a target material to be molded to form an inverted pattern of the molding material on the target material;
a transferring process for transferring the inverted pattern of the molding material to the target material by curing the target material by heating or irradiating light; and
a separating process for separating the molding material from the target material after the target material is cured through the transferring process,
wherein the separating process includes:
a pulling process for pulling the molding material away from the target material in a direction opposite to a direction in which the target material is pressed; and
a pushing process for pushing the target material in the same direction as a direction in which the molding material presses the target material, and
wherein the pressing process is performed in an atmosphere of a gas that is condensed under a temperature and a pressure obtained when the target material fills in a recess of the molding material.

2. The imprinting method of claim 1 ,
wherein the pushing process pushes the target material in the same direction as the direction in which the molding material presses the target material by inserting at least one pin through at least one through hole of the molding material and bringing the at least one pin into contact with the target material.

3. The imprinting method of claim 1 ,
wherein the pulling process and the pushing process are performed while being coupled with each other.

4. The imprinting method of claim 3 ,
wherein the pulling process and the pushing process are performed at the same time.

5. The imprinting method of claim 2 ,
wherein the at least one pin and the at least one through hole of the molding material are plural in number, and
the pins to be brought into contact with the target material through the through holes are arranged according to a pattern density on the molding material.

6. The imprinting method of claim 2 ,
wherein the at least one pin and the at least one through hole of the molding material are plural in number, and
the pins to be brought into contact with the target material through the through holes are arranged at a regular interval.

7. The imprinting method of claim 2 ,
wherein a length of the at least one pin is equal to or larger than about five times a thickness of the molding material.

8. The imprinting method of claim 1 ,
wherein the imprinting method is applied to at least one of pattern formation of a semiconductor device, pattern formation of a storage medium, pattern formation of a solar cell, pattern formation of a lens array, manufacture of a photonic crystal device and pattern formation of an antireflection film of a light emitting diode.

Assignees

• Hoshino Satohiko
• Tokyo Electron Ltd

Inventors

• Hoshino Satohiko

Classifications

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C59/022

  characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• B29C33/44 Primary

  with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles · CPC title