Method for plug-in board replacement and method for manufacturing multi-piece board

Patent metadata

Field	Value
Publication number	US-9370101-B2
Application number	US-201314014654-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Aug 30, 2012
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.

First claim

What is claimed is:

1. A plug-in board replacement method, comprising:
preparing a board having a piece board;
forming a first conductive pattern on a first surface of the board;
forming a second conductive pattern on a second surface on an opposite side of the board with respect to the first surface such that the second conductive pattern is positioned on the opposite side of the board with respect to the first conductive pattern of the board;
irradiating laser upon the first surface and second surface of the board along the first conductive pattern and the second conductive pattern such that the piece board is cut out from the board; and
fitting the piece board cut out from the board into another board,
wherein the irradiating of laser includes a first laser irradiation comprising irradiating laser upon the first surface of the board along the first conductive pattern such that the laser is irradiated along a border between an edge portion of the first conductive pattern and the first surface of the board and a second laser irradiation comprising irradiating laser upon the second surface of the board along the second conductive pattern such that the laser is irradiated along a border between an edge portion of the second conductive pattern and the second surface of the board such that the piece board is cut out through the board.

2. The plug-in board replacement method according to claim 1 , wherein the second conductive pattern is formed on the second surface of the board such that the edge portion of the second conductive pattern is positioned away from the edge portion of the first conductive pattern, the first laser irradiation forms a recess in the board, and the second laser irradiation processes a portion of the second surface of the board facing the recess such that the piece board is cut out through the board.

3. The plug-in board replacement method according to claim 1 , wherein the first laser irradiation and the second laser irradiation form a first cut surface connecting the edge portion of the first conductive pattern and the edge portion of the second conductive pattern such that the first cut surface has a portion protruding from the edge portion of the first conductive pattern and does not protrude from the edge portion of the second conductive pattern, and the fitting of the piece board includes fitting the piece board with the other board such that the edge portion of the second conductive pattern makes contact with the other board.

4. The plug-in board replacement method according to claim 1 , further comprising forming a space in the other board, wherein the fitting of the piece board comprises fixing the piece board in the space formed in the other board.

5. The plug-in board replacement method according to claim 4 , wherein the forming of the space includes forming a third conductive pattern on a surface of the other board, forming a fourth conductive pattern on an opposite surface of the other board on an opposite side with respect to the third conductive pattern on the other board, and irradiating laser upon the other board along the third conductive pattern and fourth conductive pattern formed on the other board such that a portion of the other board corresponding to the space is cut out from the other board, the irradiating of the other board includes a third laser irradiation comprising irradiating laser upon the surface of the other board along the third conductive pattern such that the laser is irradiated along a border between an edge portion of the third conductive pattern and the surface of the other board and a fourth laser irradiation comprising irradiating laser upon the opposite surface of the other board along the fourth conductive pattern such that the laser is irradiated along a border between an edge portion of the fourth conductive pattern and the opposite surface of the other board such that the portion corresponding to the space in the other board is cut out through the other board.

6. The plug-in board replacement method according to claim 5 , wherein the third laser irradiation and the fourth laser irradiation form a second cut surface connecting the edge portion of the third conductive pattern and the edge portion of the fourth conductive pattern such that the second cut surface has a portion protruding from the edge portion of the third conductive pattern and does not protrude from the edge portion of the fourth conductive pattern, and the fitting of the piece board includes fitting the piece board with the other board such that the edge portion of the fourth conductive pattern makes contact with the edge portion of the second conductive pattern.

7. The plug-in board replacement method according to claim 1 , wherein each of the board and the other board is a multi-piece board having a plurality of wiring boards and a frame connected to the plurality of wiring boards.

8. A method for manufacturing a multi-piece board, comprising:
preparing a board having a piece wiring board;
forming a first conductive pattern on a first surface of the board;
forming a second conductive pattern on a second surface on an opposite side of the board with respect to the first surface such that the second conductive pattern is positioned on the opposite side of the board with respect to the first conductive pattern of the board;
irradiating laser upon the first surface and second surface of the board along the first conductive pattern and the second conductive pattern such that the piece wiring board is cut out from the board; and
fitting the piece wiring board cut out from the board into a frame,
wherein the irradiating of laser includes a first laser irradiation comprising irradiating laser upon the first surface of the board along the first conductive pattern such that the laser is irradiated along a border between an edge portion of the first conductive pattern and the first surface of the board and a second laser irradiation comprising irradiating laser upon the second surface of the board along the second conductive pattern such that the laser is irradiated along a border between an edge portion of the second conductive pattern and the second surface of the board such that the piece wiring board is cut out through the board.

9. The method for manufacturing a multi-piece board according to claim 8 , wherein the second conductive pattern is formed on the second surface of the board such that the edge portion of the second conductive pattern is positioned away from the edge portion of the first conductive pattern, the first laser irradiation forms a recess in the board, and the second laser irradiation processes a portion of the second surface of the board facing the recess such that the piece wiring board is cut out through the board.

10. The method for manufacturing a multi-piece board according to claim 8 , wherein the first laser irradiation and the second laser irradiation form a first cut surface connecting the edge portion of the first conductive pattern and the edge portion of the second conductive pattern such that the first cut surface has a portion protruding from the edge portion of the first conductive pattern and does not protrude from the edge portion of the second conductive pattern, and the fitting of the piece wiring board includes fitting the piece wiring board with the frame such that the edge portion of the second conductive pattern makes contact with the other board.

11. The method for manufacturing a multi-piece board according to claim 8 , further comprising forming a space in the frame, wherein the fitting of the piece wiring board comprises fixing the piece wiring board in the space formed in the frame.

12. The method for manufac

Assignees

• Ibiden Co Ltd

Inventors

• Ishihara Teruyuki
• Takahashi Michimasa

Classifications

• H05K3/36

  Assembling printed circuits with other printed circuits {(H05K7/142 takes precedence)} · CPC title

• H05K2203/1572

  Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides · CPC title

• H05K3/0032 Primary

  of organic insulating material · CPC title

• H05K2203/0169

  Using a temporary frame during processing · CPC title

• H05K3/0097

  Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence) · CPC title