Optical waveguide device module

US9366825B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9366825-B2
Application numberUS-201514745069-A
CountryUS
Kind codeB2
Filing dateJun 19, 2015
Priority dateMar 29, 2010
Publication dateJun 14, 2016
Grant dateJun 14, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An optical waveguide device module has an optical waveguide device including an optical waveguide formed in a substrate, and a control electrode for controlling light; and a connection substrate including an interconnection, provided to the outside of the waveguide device, electrically connected to the control electrode. The control electrode includes ground electrodes that sandwich a signal electrode. The connection substrate has ground lines that sandwich a signal line. A width of the signal electrode in an input or output end is smaller than a width of the signal line on the waveguide device side. A distance between inner edges of the ground electrodes closest to the signal electrode, measured at an input or output end of the control electrode, is larger than a distance between inner edges of the ground lines closest to the signal line on the waveguide device side of the connection substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. An optical waveguide device module comprising: an optical waveguide device including a substrate having an electro-optic effect, an optical waveguide formed in the substrate, and a control electrode for controlling light waves propagated through the optical waveguide; a connection substrate including an interconnection, provided to the outside of the optical waveguide device, which is electrically connected to the control electrode; and a casing that accommodates the optical waveguide device and the connection substrate therein, wherein the control electrode includes a signal electrode and ground electrodes disposed so as to sandwich the signal electrode, the connection substrate is provided with a signal line and ground lines disposed so as to sandwich the signal line, a dielectric constant of the connection substrate is lower than a dielectric constant of the substrate included in the optical waveguide device, a width S 1 between outer edges of the signal electrode closest to the ground electrodes, measured at an input end or an output end of the control electrode, is smaller than a width S 2 between outer edges of the signal line closest to the ground lines on an optical waveguide device side of the connection substrate, a distance W 1 between inner edges of the ground electrodes closest to the signal electrode, measured at an input end or output end of the control electrode, is larger than a distance W 2 between inner edges of the ground lines closest to the signal line on the optical waveguide device side of the connection substrate, the control electrode has a portion in which the distance between the ground electrodes is smaller than the distance W 2 in a portion away from the input end or the output end thereof, and the optical waveguide device module includes ground interconnections that connect the optical waveguide device and the ground lines of the connection substrate. 2. The optical waveguide device module according to claim 1 , wherein multiple ground interconnections connect the optical waveguide device and the ground lines of the connection substrate. 3. The optical waveguide device module according to claim 2 , wherein a distance W between the ground interconnections measured at a point where the ground interconnections connect with the ground lines is smaller than the distance W 1 . 4. The optical waveguide device module according to claim 2 , wherein a connection position of an end on the optical waveguide device side of the ground interconnection is connected to a portion smaller than the distance W 2 . 5. The optical waveguide device module according to claim 2 , wherein the optical waveguide device module includes other interconnections, which are disposed so as to sandwich the ground interconnections that connect the optical waveguide device and the connection substrate, and of which the interconnection distance is larger than the distance W 1 . 6. The optical waveguide device module according to claim 2 , wherein the interconnection that connects the optical waveguide device and the connection substrate is formed by wire bonding. 7. The optical waveguide device module according to claim 1 , wherein a distance W between the ground interconnections measured at a point where the ground interconnections connect with the ground lines is smaller than the distance W 1 . 8. The optical waveguide device module according to claim 7 , wherein a connection position of the end on the optical waveguide device side of the ground interconnection is connected to a portion smaller than the distance W 2 . 9. The optical waveguide device module according to claim 7 , wherein the optical waveguide device module includes other interconnections, which are disposed so as to sandwich the ground interconnections that connect the optical waveguide device and the connection substrate, and of which the interconnection distance is larger than the distance W 1 . 10. The optical waveguide device module according to claim 7 , wherein the interconnection that connects the optical waveguide device and the connection substrate is formed by wire bonding. 11. The optical waveguide device module according to claim 1 , wherein a connection position of an end on the optical waveguide device side of the ground interconnection is connected to a portion smaller than the distance W 2 . 12. The optical waveguide device module according to claim 11 , wherein the optical waveguide device module includes other interconnections, which are disposed so as to sandwich the ground interconnection that connects the optical waveguide device and the connection substrate, and of which the interconnection distance is larger than the distance W 1 . 13. The optical waveguide device module according to claim 11 , wherein the interconnection that connects the optical waveguide device and the connection substrate is formed by wire bonding. 14. The optical waveguide device module according to claim 1 , wherein the optical waveguide device module includes other interconnections, which are disposed so as to sandwich the ground interconnections that connect the optical waveguide device and the connection substrate, and of which the interconnection distance is larger than the distance W 1 . 15. The optical waveguide device module according to claim 14 , wherein the interconnection that connects the optical waveguide device and the connection substrate is formed by wire bonding. 16. The optical waveguide device module according to claim 1 , wherein the interconnection that connects the optical waveguide device and the connection substrate is formed by wire bonding.

Assignees

Inventors

Classifications

  • G02B6/3608Primary

    Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets (optical ribbon cables in support members G02B6/4401) · CPC title

  • G02F1/0316Primary

    Electrodes · CPC title

  • controlled by a high-frequency electromagnetic wave component in an electric waveguide structure · CPC title

  • G02F1/035Primary

    in an optical waveguide structure · CPC title

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What does patent US9366825B2 cover?
An optical waveguide device module has an optical waveguide device including an optical waveguide formed in a substrate, and a control electrode for controlling light; and a connection substrate including an interconnection, provided to the outside of the waveguide device, electrically connected to the control electrode. The control electrode includes ground electrodes that sandwich a signal el…
Who is the assignee on this patent?
Sumitomo Osaka Cement Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/3608. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).