Flexible Structured Optical Modules

Patent metadata

Field	Value
Publication number	US-2016274321-A1
Application number	US-201615075126-A
Country	US
Kind code	A1
Filing date	Mar 19, 2016
Priority date	Mar 21, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

Optical modules as used in various types of communication systems are formed to include a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints. The flexible substrate is formed of a polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 μms, in most cases). The flexible polyimide film is sized to accommodate the constraints of a given package “footprint”; more particularly, sized to fit an open ‘floor area’ within package, allowing for a populated film to be placed around various other “fixed-in-place” elements . The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and associated optical fiber traces.

First claim

What is claimed is:

1 . An optical module comprising
a plurality of optical components; a plurality of electro-optic components; sections of optical fiber interconnecting the plurality of optical components and the plurality of electro-optic components in a predetermined configuration; and a flexible substrate including an adhesive-coated surface layer, where the plurality of optical components and the plurality of electro-optic components are affixed to the adhesive-coated surface layer and the sections of optical fiber are disposed in paths formed within the adhesive-coated surface layer.

2 . The optical module as defined in claim 1 wherein the flexible substrate is formed to include openings for accommodating additional system elements.

3 . The optical module as defined in claim 2 wherein the additional system elements include fixed-in-place components.

4 . The optical module as defined in claim 1 wherein the flexible substrate comprises multiple layers of flexible material disposed over one another.

5 . The optical module as defined in claim 4 wherein at least one layer of flexible material supports a coil of optical fiber.

6 . The optical module as defined in claim 5 wherein the coil of optical fiber comprises a coil of rare earth-doped optical fiber utilized for an optical amplifier.

7 . The optical module as defined in claim 1 wherein the module further comprises at least one heater element affixed to the adhesive-coated surface layer of the flexible substrate.

8 . The optical module as defined in claim 1 wherein the module further comprises at least one cooler element affixed to the adhesive-coated surface layer of the flexible substrate.

9 . The optical module as defined in claim 1 wherein the adhesive-coated surface layer comprises a pressure-sensitive adhesive material.

10 . The optical module as defined in claim 1 wherein the flexible substrate comprises a film of polyimide material.

11 . An optical module comprising
a plurality of optical components; a plurality of electro-optic components; sections of optical fiber interconnecting the plurality of optical components and the plurality of electro-optic components in a predetermined configuration; and a flexible substrate including an adhesive-coated surface layer, where the plurality of optical components and the plurality of electro-optic components are affixed to the adhesive-coated surface layer.

12 . An optical module as defined in claim 11 wherein the sections of optical fiber are disposed in paths formed within the adhesive-coated surface layer.

Assignees

• Ii Vi Inc

Inventors

• Mcclean Ian Peter
• Gurusami Aravanan
• Smart Richard
• Garrett Mark H
• Filipowicz Mark

Classifications

• G02B6/3608 Primary

  Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets (optical ribbon cables in support members G02B6/4401) · CPC title

• G02B6/4268

  Cooling (of instruments G12B15/00; of electric apparatus H05K7/20; of semiconductor devices H10W76/47) · CPC title

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/4257 Primary

  having a supporting carrier or a mounting substrate or a mounting plate (G02B6/3648 takes precedence) · CPC title

• G02B6/4266

  Thermal aspects, temperature control or temperature monitoring (thermal aspect of electrical circuits H05K7/20, H05K5/0213, temperature control in general G05D23/19) · CPC title