Packaging devices and methods of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9355978-B2
Application number	US-201313894107-A
Country	US
Kind code	B2
Filing date	May 14, 2013
Priority date	Mar 11, 2013
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer disposed over the substrate and a first portion of the contact pad. A second portion of the contact pad is exposed. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to the second portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes a hollow region.

First claim

What is claimed is:

1. A packaging device, comprising:
a contact pad disposed over a substrate;
a passivation layer disposed over the substrate and a first portion of the contact pad, wherein a second portion of the contact pad is exposed;
a post passivation interconnect (PPI) line disposed over the passivation layer coupled to the second portion of the contact pad;
a PPI pad disposed over the passivation layer, the PPI pad comprising a first side and a second side opposite the first side;
a transition element disposed over the passivation layer coupled between the PPI line and the PPI pad, wherein the transition element comprises a hollow region, and wherein the transition element is coupled to the first side of the PPI pad; and
an extension element coupled to the second side of the PPI pad.

2. The packaging device according to claim 1 , wherein a portion of the transition element comprises a first shape, wherein a portion of the extension element comprises a second shape, and wherein the second shape is substantially the same as the first shape.

3. The packaging device according to claim 1 , wherein the extension element is further coupled to a third side and a fourth side of the PPI pad, the third side being substantially perpendicular to the first side, wherein the fourth side of the PPI pad is opposite the third side of the PPI pad, and wherein a portion of the extension element coupled to the third side and the fourth side of the PPI pad is coupled to the transition element.

4. The packaging device according to claim 3 , wherein the transition element and the extension element comprise a ring member coupled to the PPI line and a plurality of radial members coupled between the PPI pad and the ring member.

5. The packaging device according to claim 1 , wherein a distance between the PPI line and the PPI pad comprises about 150 μm or less.

6. A packaging device, comprising:
a contact pad disposed over a substrate;
a passivation layer disposed over the substrate and a first portion of the contact pad, wherein a second portion of the contact pad is exposed;
a post passivation interconnect (PPI) line disposed over the passivation layer coupled to the second portion of the contact pad;
a PPI pad disposed over the passivation layer, wherein a distance between the PPI line and the PPI pad comprises about 150 μm or less; and
a transition element disposed over the passivation layer coupled between the PPI line and the PPI pad, wherein the transition element comprises a hollow region.

7. A packaging device, comprising:
a substrate;
a contact pad disposed over the substrate;
a passivation layer disposed over the substrate and a first portion of the contact pad, wherein a second portion of the contact pad is exposed;
a post passivation interconnect (PPI) line disposed over the passivation layer coupled to the second portion of the contact pad;
a PPI pad disposed over the passivation layer;
a transition element disposed over the passivation layer coupled between the PPI line and the PPI pad, the transition element comprising a hollow region, a plurality of first conjugation lines disposed substantially parallel to the PPI line, a plurality of second conjugation lines disposed substantially perpendicular to the PPI line, and a connection line disposed substantially perpendicular to the PPI line, the connection line being coupled to the PPI line, wherein each of the plurality of first conjugation lines is coupled between the connection line and the PPI pad and each of the plurality of second conjugation lines is coupled to the PPI pad or to one of the plurality of first conjugation lines; and
a conductive material disposed over the PPI pad.

8. A packaging device, comprising:
a substrate;
a contact pad disposed over the substrate;
a passivation layer disposed over the substrate and a first portion of the contact pad, wherein a second portion of the contact pad is exposed;
a post passivation interconnect (PPI) line disposed over the passivation layer coupled to the second portion of the contact pad;
a PPI pad disposed over the passivation layer;
a transition element disposed over the passivation layer coupled between the PPI line and the PPI pad, the transition element comprising a hollow region;
a conductive material disposed over the PPI pad; and
a wetting region comprised of a material of the conductive material disposed over a portion of the transition element, wherein the wetting region is not disposed over the PPI line.

9. The packaging device according to claim 8 , wherein the transition element comprises a plurality of conjugation lines.

10. The packaging device according to claim 9 , wherein the plurality of conjugation lines is coupled between the PPI line and the PPI pad at a plurality of different angles with respect to the PPI line.

11. The packaging device according to claim 10 , wherein one of the plurality of conjugation lines is substantially parallel to the PPI line.

12. The packaging device according to claim 9 , wherein the plurality of conjugation lines is disposed substantially parallel to the PPI line, wherein the transition element further comprises a connection line disposed substantially perpendicular to the PPI line, the connection line being coupled to the PPI line, and wherein each of the plurality of conjugation lines is coupled between the connection line and the PPI pad.

13. The packaging device according to claim 12 , wherein the plurality of conjugation lines is not coupled to the connection line at an acute angle.

14. The packaging device according to claim 12 , wherein the plurality of conjugation lines comprises a plurality of first conjugation lines, wherein the transition element further comprises a plurality of second conjugation lines, the plurality of second conjugation lines being disposed substantially perpendicular to the PPI line, and wherein each of the plurality of second conjugation lines is coupled to the PPI pad or to one of the plurality of first conjugation lines.

15. The packaging device according to claim 8 , further comprising a polymer layer disposed over the passivation layer, wherein the PPI line, the PPI pad, and the transition element are disposed over the polymer layer.

16. The packaging device according to claim 8 , wherein the conductive material directly contacts the PPI pad.

17. A method of manufacturing a packaging device, the method comprising:
forming a contact pad over a substrate;
forming a passivation layer over the substrate and a first portion of the contact pad yet leaving a second portion of the contact pad exposed;
forming a post passivation interconnect (PPI) line, a transition element, and a PPI pad over the passivation layer, wherein the PPI line is coupled to the second portion of the contact pad, wherein the transition element is coupled to the PPI line and comprises a hollow region, and wherein the PPI pad is coupled to the transition element; and
forming a conductive material over the PPI pad and a portion of the transition element, wherein the conductive material is not formed over any portion of the PPI line.

18. The method according to claim 17 , wherein forming the PPI pad comprises forming a PPI pad having a first width, wherein forming the transition element comprises forming a transition element including a hollow region having a second width, and wherein the second width is about 1/10 to about ⅓ of the first width.

19. The method according to claim 17 , wherein forming the transition element comprises forming a transition elem

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Chen Hsien-Wei
• Yu Tsung-Yuan
• Tsai Hao-Yi
• Lii Mirng-Ji
• Yu Chen-Hua

Classifications

• H10W80/743

  having disposition changed during the connecting · CPC title

• H10W74/147

  the encapsulations being multilayered · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title