Semiconductor device with self-aligned contact plugs

US9355957B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9355957-B2
Application numberUS-201514685823-A
CountryUS
Kind codeB2
Filing dateApr 14, 2015
Priority dateJun 18, 2013
Publication dateMay 31, 2016
Grant dateMay 31, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A semiconductor device includes subsurface structures extending from a main surface into a semiconductor portion, each subsurface structure including a gate electrode dielectrically insulated from the semiconductor portion. The semiconductor device further includes alignment plugs in a vertical projection of the subsurface structures, contact spacers extending along sidewalls of the alignment plugs tilted to the main surface, and contact plugs directly adjoining semiconductor mesas between the subsurface structures. The contact plugs are provided between opposing ones of the contact spacers.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductor device, comprising: subsurface structures extending from a main surface into a semiconductor portion, each subsurface structure comprising a gate electrode dielectrically insulated from the semiconductor portion; alignment plugs in a vertical projection of the subsurface structures; contact spacers extending along sidewalls of the alignment plugs tilted to the main surface; and contact plugs directly adjoining semiconductor mesas between the subsurface structures, the contact plugs provided between opposing ones of the contact spacers; wherein the alignment plugs comprise (i) gate contact spacers of a first auxiliary material along sidewalls of the contact spacer opposite to the contact plugs and (ii) gate contacts between the gate contact spacers assigned to a respective subsurface structure. 2. The semiconductor device of claim 1 , further comprising: source zones of a first conductivity type in the semiconductor mesas directly adjoining the main surface. 3. The semiconductor device of claim 1 , further comprising: body zones of a complementary second conductivity type in the semiconductor mesas, the body zones forming first pn junctions with the source zones and second pn junctions with a drift layer of the first conductivity type.

Assignees

Inventors

Classifications

  • Vertical DMOS [VDMOS] FETs · CPC title

  • for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies · CPC title

  • H10D12/481Primary

    having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs · CPC title

  • by forming self-aligned vias or self-aligned contact plugs · CPC title

  • H10W20/43Primary

    Layouts of interconnections · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9355957B2 cover?
A semiconductor device includes subsurface structures extending from a main surface into a semiconductor portion, each subsurface structure including a gate electrode dielectrically insulated from the semiconductor portion. The semiconductor device further includes alignment plugs in a vertical projection of the subsurface structures, contact spacers extending along sidewalls of the alignment p…
Who is the assignee on this patent?
Infineon Technologies Austria
What technology area does this patent fall under?
Primary CPC classification H10D12/481. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 31 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).