Method and apparatus for removing organic materials

Patent metadata

Field	Value
Publication number	US-9352364-B2
Application number	US-201313874595-A
Country	US
Kind code	B2
Filing date	May 1, 2013
Priority date	Sep 7, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A method for removing organic materials includes providing a target object having the organic materials adsorbed thereon, and an adsorbent, into a space including a non-liquid medium therein; and separating the organic materials from the target object by applying ultrasound waves to the target object having the organic materials adsorbed thereon and the adsorbent in the space, and disposing the organic materials to the adsorbent.

First claim

What is claimed is:

1. A method of removing organic materials, the method comprising:
providing a target object having the organic materials adsorbed on a surface thereof, and an adsorbent, into a space comprising a non-liquid medium therein; and
separating the organic materials from the target object, comprising:
applying ultrasound waves to the target object having the organic materials adsorbed on the surface thereof and the adsorbent, in the space;
contacting the adsorbent with the organic materials on the surface of the target object by applying the ultrasound waves in the space; and
disposing the organic materials on the adsorbent by contacting the adsorbent with the organic materials.

2. The method of claim 1 , the separating the organic materials from the target object further comprising separating the adsorbent having the organic materials disposed thereon from the target object after the ultrasound waves are applied.

3. The method of claim 1 , wherein:
the non-liquid medium is a gaseous medium;
the space is a chamber comprising the gaseous medium; and
the ultrasound waves are applied to the target object having the organic materials adsorbed on the surface thereof and the adsorbent, in the gaseous medium of the chamber.

4. The method of claim 3 , wherein the chamber further comprises a surface on which static electricity is generated due to friction between the adsorbent and the surface.

5. The method of claim 1 , wherein:
providing a target object and an adsorbent comprises placing the adsorbent adjacent to the target object; and
applying the ultrasound waves to the target object comprises placing an ultrasonicator at a location adjacent to the adjacent adsorbent and target object, and applying ultrasound waves generated by the ultrasonicator to the adjacent adsorbent and target object.

6. A method of removing organic materials, the method comprising:
providing a target object having the organic materials adsorbed thereon, and an adsorbent, into a space comprising a non-liquid medium therein; and
separating the organic materials from the target object by applying ultrasound waves to the target object having the organic materials adsorbed thereon and the adsorbent in the space, and disposing the organic materials on the adsorbent,
wherein the target object comprises particles, and the organic materials are adsorbed on surfaces of the particles.

7. The method of claim 6 , wherein a mean diameter of the particles is 3 nanometers to 1000 nanometers.

8. The method of claim 6 , wherein the target object further comprises a supporter which supports the particles.

9. The method of claim 1 , wherein the target object comprises a polymeric material, and the organic materials are adsorbed on a surface of the polymeric material.

10. The method of claim 1 , wherein the target object comprises a polymeric material in the form of a film, and the organic materials are adsorbed on a surface of the film.

11. The method of claim 1 , wherein the target object comprises a semiconductor substrate or a printed circuit board, and the organic materials are adsorbed on a surface of the semiconductor substrate or the printed circuit board.

12. The method of claim 2 , wherein separating the adsorbent from the target object comprises applying a gas to the target object.

13. The method of claim 2 , wherein separating the adsorbent from the target object comprises using an electrostatic force.

14. The method of claim 1 , wherein the adsorbent comprises carbon black, a metal-organic framework compound, a zeolitic imidazolate framework compound, a covalent-organic framework compound, activated carbon, a zeolite, silica, a metal oxide, or a combination thereof, or a material obtained by carbonization, oxidation, or heating of the foregoing.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jun-Ho
• Lee Seung-Yeon
• Lee Kang-Hee
• Jin Seon-Ah

Classifications

• H10P70/12

  by dry cleaning only (H10P70/52 takes precedence) · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• B08B7/028 Primary

  Using ultrasounds · CPC title

• B08B7/00

  Cleaning by methods not provided for in a single other subclass or a single group in this subclass · CPC title