Method for manufacturing electronic device, cover body, electronic device, electronic apparatus, and moving object

Patent metadata

Field	Value
Publication number	US-9350318-B2
Application number	US-201314085948-A
Country	US
Kind code	B2
Filing date	Nov 21, 2013
Priority date	Nov 26, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A method for manufacturing an electronic device is provided, in which a base and a lid as a cover body are bonded together while forming an interior space between the base and the lid. The method includes: a step of preparing the lid including a groove communicating the interior space with the outside, the groove being in a back surface of the lid; a step of accommodating a gyro element as an electronic component in the interior space; a first bonding step of bonding the base and the lid together by seam welding at an area for bonding except for a portion corresponding to the groove; and a second bonding step of bonding the base and the lid by welding using a laser beam at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.

First claim

What is claimed is:

1. A method for manufacturing an electronic device, in which a base and a cover body are bonded together while forming an interior space for accommodating an electronic component between the base and the cover body, the method comprising:
a step of preparing the cover body including a groove communicating the interior space with the outside, the groove being in a surface of the cover body on the side to be bonded with the base;
a step of accommodating the electronic component in the interior space;
a first bonding step of bonding the base and the cover body together by welding at an area for bonding the base and the cover body together except for an unwelded portion including a portion at which the base and the cover body are not welded due to the groove; and
a second bonding step of bonding the base and the cover body together by energy beam welding at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.

2. The method for manufacturing an electronic device according to claim 1 , wherein
the first bonding step is a step of performing the bonding by seam welding.

3. The method for manufacturing an electronic device according to claim 2 , wherein
at least one of the base and the cover body includes a metal layer, the metal layer having a thickness smaller than the depth of the groove, and
in the first bonding step, the metal layer is melted by the seam welding to bond the base and the cover body together.

4. The method for manufacturing an electronic device according to claim 1 , wherein
the relation of L1>L2 is satisfied, where L1 is the width of the groove, and L2 is the depth of the groove.

5. The method for manufacturing an electronic device according to claim 2 , wherein
the outline of the cover body in plan view is a rectangular shape, and
in the first bonding step, the seam welding is performed along each side of the cover body in plan view.

6. The method for manufacturing an electronic device according to claim 5 , wherein
the groove is disposed at a side portion of the cover body in plan view.

7. The method for manufacturing an electronic device according to claim 1 , wherein
using a plate-like cover body including a circumferential surface connecting a front surface with a back surface, the base and the cover body are bonded together through the first bonding step.

8. The method for manufacturing an electronic device according to claim 7 , wherein
the groove has one of ends opened in the circumferential surface of the cover body and the other end disposed at a position facing the interior space, and
the base and the cover body are bonded together through the first bonding step.

9. The method for manufacturing an electronic device according to claim 7 , wherein
in the second bonding step, the base and the cover body are bonded by energy beam welding at a portion of the area for bonding, the portion including one of ends of the groove on the outside side.

10. The method for manufacturing an electronic device according to claim 1 , further comprising, after the first bonding step, a step of performing evacuation of the interior space through the groove, wherein
the second bonding step is disposed after the step of performing the evacuation.

Assignees

• Seiko Epson Corp

Inventors

• Aoki Shinya
• Shimura Masashi

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• B23K26/22

  Spot welding · CPC title

• B23K26/21

  by welding · CPC title

• H03H9/1014 Primary

  the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device · CPC title