Multilayer ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9349536-B2
Application number	US-201213715974-A
Country	US
Kind code	B2
Filing date	Dec 14, 2012
Priority date	Nov 7, 2012
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers; an oxide film formed on one surface of the ceramic body; first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body; a first internal electrode formed on the dielectric layer and including a first electrode lead-out portion exposed to the first external electrode and a first insulating lead-out portion exposed to the oxide film and having a composite-metal-oxide region formed in an exposed edge portion thereof; a second internal electrode facing the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode lead-out portion exposed to the second external electrode and a second insulating lead-out portion exposed to the oxide film, having a composite-metal-oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance.

First claim

What is claimed is:

1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers;
an oxide film formed on one surface of the ceramic body;
first and second external electrodes formed on both sides of the oxide film on one surface of the ceramic body;
a first internal electrode formed on the dielectric layer and including a first electrode main portion, a first electrode lead-out portion extending from a side of the first electrode main portion and exposed to the first external electrode, and a first insulating lead-out portion extending from the first electrode main portion and exposed to the oxide film and having a composite metal oxide region formed in an exposed edge portion thereof;
a second internal electrode disposed to face the first internal electrode, having the dielectric layer interposed therebetween, and including a second electrode main portion, a second electrode lead-out portion extending from a side of the second electrode main portion and exposed to the second external electrode, and a second insulating lead-out portion extending from the second electrode main portion and exposed to the oxide film, having a composite metal oxide region formed in an exposed edge portion thereof, and overlapped with the first insulating lead-out portion to form additional capacitance;
at least one of a first margin portion extending from the side of the first electrode main portion or a second margin portion extending from the side of the second electrode main portion; and
an insulating layer disposed on the oxide film,
wherein an exposed end of the first electrode lead-out portion and an exposed end of the first insulating lead-out portion are disposed on a substantially straight line, and an exposed end of the second electrode lead-out portion and an exposed end of the second insulating lead-out portion are disposed on a substantially straight line, and
wherein the oxide film is a composition different than that of the insulating layer.

2. The multilayer ceramic electronic component of claim 1 , wherein the oxide film entirely covers a region in which the first and second insulating lead-out portions are overlapped with each other.

3. The multilayer ceramic electronic component of claim 1 , wherein the insulating layer is formed between the first external electrode and the second external electrode.

4. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes are exposed to one surface of the ceramic body in the width direction.

5. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes are disposed perpendicularly with regard to a mounting surface of the ceramic body.

6. The multilayer ceramic electronic component of claim 1 , wherein the first and second external electrodes are formed on one surface of the ceramic body in a width direction and extended to one surface or the other surface of the ceramic body in a thickness direction.

7. The multilayer ceramic electronic component of claim 6 , wherein the insulating layer covers both of the oxide film and portions of the first and second external electrodes formed on one surface of the ceramic body in the width direction.

8. The multilayer ceramic electronic component of claim 6 , wherein the first and second internal electrodes are disposed in parallel with regard to a mounting surface of the ceramic body.

9. The multilayer ceramic electronic component of claim 1 , wherein the oxide film includes at least one selected from a group consisting of magnesium (Mg), manganese (Mn), silicon (Si), and cobalt (Co).

10. The multilayer ceramic electronic component of claim 1 , wherein the oxide film includes at least one selected from a group consisting of manganese oxide (MnO), manganese dioxide (MnO 2 ), dimanganese trioxide (Mn 2 O 3 ), trimanganese tetraoxide (Mn 3 O 4 ), and magnesium oxide (MgO).

11. The multilayer ceramic electronic component of claim 1 , wherein the composite metal oxide region contains Ni—Mg—O, Ni—Mn—O, or Ni—Mg—Mn—O.

12. The multilayer ceramic electronic component of claim 1 , wherein the insulating layer includes at least one of an organic resin, a ceramic material, an inorganic filler, or glass, or mixtures thereof.

13. The multilayer ceramic electronic component of claim 1 , wherein the oxide film includes components of a composite oxide in the first and second internal electrodes.

14. The multilayer ceramic electronic component of claim 1 , wherein at least one of the first internal electrode or the second internal electrode includes a cut-out space, and
wherein the cut-out space of the at least one of the first internal electrode or the second internal electrode is arranged adjacent to the first insulating lead-out portion or the second insulating lead-out portion, respectively.

15. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers;
first and second internal electrodes having first and second electrode main portions, respectively, and first and second lead-out portions extending from a side of the first and second electrode main portions and having an overlapped region and exposed to one surface of the ceramic body, respectively;
an oxide film covering the overlapped region of the first and second lead-out portions;
first and second external electrodes connected to the first and second lead-out portions and formed on both sides of the oxide film, respectively;
at least one of a first margin portion extending from the side of the first electrode main portion or a second margin portion extending from the side of the second electrode main portion; and
an insulating layer disposed on the oxide film,
wherein the first and second lead-out portions have composite metal oxide regions formed in edge portions thereof, covered with the oxide film,
wherein an exposed end of the first lead-out portion and an exposed end of a first insulating lead-out portion are disposed on a substantially straight line, and an exposed end of the second lead-out portion and an exposed end of a second insulating lead-out portion are disposed on a substantially straight line, and
wherein the oxide film is a composition different than that of the insulating layer.

16. The multilayer ceramic electronic component of claim 15 , wherein the insulating layer includes at least one of an organic resin, a ceramic material, an inorganic filler, or glass, or mixtures thereof.

17. The multilayer ceramic electronic component of claim 15 , wherein the oxide film includes components of a composite oxide in the first and second internal electrodes.

18. The multilayer ceramic electronic component of claim 15 , wherein at least one of the first internal electrode or the second internal electrode includes a cut-out space, and
wherein the cut-out space of the at least one of the first internal electrode or the second internal electrode is arranged adjacent to the first insulating lead-out portion or the second insulating lead-out portion, respectively.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jong Ho
• Choi Jae Yeol
• Kim Doo Young
• Cho Hang Kyu
• Kim Eung Soo
• Han Byung Woo

Classifications

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01L41/0533

  Electricity · mapped topic

• H01G2/103 Primary

  Sealings, e.g. for lead-in wires; Covers · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title