Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device

Patent metadata

Field	Value
Publication number	US-9511220-B2
Application number	US-201514600401-A
Country	US
Kind code	B2
Filing date	Jan 20, 2015
Priority date	Jan 16, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

First claim

What is claimed is:

1. A filter feedthrough for an active implantable medical device, the filter feedthrough comprising:
a) a hermetic feedthrough, comprising:
i) a conductive ferrule comprising a ferrule sidewall having an inner ferrule surface defining a ferrule opening, wherein the ferrule sidewall extends from a first ferrule end surface spaced from a second ferrule end surface;
ii) a dielectric substrate disposed partially within and hermetically sealed to the inner ferrule surface, wherein the dielectric substrate comprises an elevated portion extending outwardly from the first ferrule end surface to an opposed dielectric end surface adjacent to the second ferrule end surface;
iii) at least one via hole extending through the dielectric substrate from an outer surface of the elevated portion to the opposed dielectric end surface;
iv) a conductive fill disposed within the at least one via hole in a hermetically sealed relationship therewith to thereby provide an electrically conductive path extending from a first fill end adjacent to an outer surface of the elevated portion of the dielectric substrate to a second fill end adjacent to the second dielectric end surface; and
v) a leadwire connection feature contacting the elevated dielectric portion, but spaced from the ferrule and spaced from the conductive fill,
vi) wherein the leadwire connection feature is electrically coupled to the conductive fill;

b) a feedthrough capacitor, comprising:
i) a capacitor dielectric body;
ii) at least one active electrode plate and at least one ground electrode plate encased in the capacitor dielectric body in spaced relation with each other;
iii) at least one open bore formed axially through the capacitor dielectric body;
iv) a first metallization contacting the bore in conductive relation with the active electrode plate;
v) a second metallization contacting an outer surface of the capacitor dielectric body in conductive relation with the ground electrode plate,
vi) wherein the capacitor dielectric body is mounted adjacent to the feedthrough with the second metallization electrically coupled to the conductive ferrule; and

c) an electrically conductive material physically contacting and electrically coupling the first metallization in the open bore to the second fill end in the at least one via hole to thereby electrically connect the at least one active electrode plate to the lead wire connection feature.

2. The feedthrough of claim 1 , wherein a circuit trace disposed within the dielectric substrate electrically couples from the conductive fill to the leadwire connection feature.

3. The feedthrough of claim 1 , wherein the dielectric substrate has a dielectric constant that is less than 10.

4. The feedthrough of claim 3 , wherein the hermetic seal comprises a tortuous and mutually conformal knitline between the dielectric substrate and the conductive fill.

5. The feedthrough of claim 4 , wherein the knitline comprises a glass that is at least about 60% silica.

6. The feedthrough of claim 1 , wherein the leadwire connection feature comprises a wire bond pad.

7. The feedthrough of claim 1 , including a conductive leadwire electrically coupled to the leadwire connection feature.

8. The feedthrough of claim 1 , wherein the dielectric substrate comprises at least 99% alumina.

9. The feedthrough of claim 1 , wherein the conductive fill comprises a substantially closed pore and fritless platinum fill.

Assignees

• Greatbatch Ltd

Inventors

• Marzano Thomas
• Seitz Keith W
• Stevenson Robert A
• Tang Xiaohong
• Thiebolt William C
• Frysz Christine A
• Brendel Richard L
• Woods Jason
• Winn Steven W
• Frustaci Dominick J
• Truex Bruehl E
• Hickel Jr Donald H

Classifications

• A61N1/375

  Constructional arrangements, e.g. casings · CPC title

• A61N1/37512

  Pacemakers · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H01G4/005

  Electrodes · CPC title