Tilted gratings and method for production of tilted gratings

Patent metadata

Field	Value
Publication number	US-9348067-B2
Application number	US-201013319196-A
Country	US
Kind code	B2
Filing date	Jun 9, 2010
Priority date	Jun 16, 2009
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

The present invention relates to phase-contrast imaging which visualizes the phase information of coherent radiation passing a scanned object. Focused gratings are used which reduce the creation of trapezoid profile in a projection with a particular angle to the optical axis. A laser supported method is used in combination with a dedicating etching process for creating such focused grating structures.

First claim

The invention claimed is:

1. A method for fabricating a grating for a phase contrast imaging apparatus for examining an object of interest, the grating having a primary axis which is arranged in a direction towards a source of radiation when the grating is installed in the imaging apparatus, the method comprising the steps of: writing, with a beam of electromagnetic radiation, at least a first trench into a wafer material; smoothing surfaces of the written first trench by etching technology; wherein the first trench has a depth in a first direction; wherein the first direction is different from the primary axis, such that the first trench is tilted by a first angle with respect to the primary axis.

2. The method of claim 1 , further comprising the step of: filling at least a first trench with an absorbing material.

3. A grating for a phase contrast imaging apparatus for examining an object of interest, the grating having a primary axis which is arranged in a direction towards a source of radiation when the grating is installed in the imaging apparatus, the grating comprising:
a wafer material having inside:
a first trench having a depth in a first direction, the first direction being different from the primary axis, such that the first trench is tilted with respect to the primary axis, said grating comprising a substrate that has a surface perpendicular to said primary axis, the first trench being tilted by a first angle with respect to the primary axis; and
a second trench tilted by a second angle with respect to the primary axis, the first angle being smaller than the second angle,

said source serving as a focal spot of said radiation.

4. The grating of claim 3 , fabricated by a method comprising the steps of: writing, with a beam of electromagnetic radiation, said first trench into said wafer material; smoothing surfaces of the written first trench by etching technology; wherein said first trench has a depth in said first direction; wherein said first direction is different from said primary axis, such that said first trench is tilted by said first angle with respect to said primary axis.

5. The grating of claim 3 , said wafer material having inside: a sequence of trenches that includes the first and second trenches, wherein each trench of the sequence of trenches is tilted by a respective angle with respect to the primary axis, and wherein the respective angle increases from trench to trench.

6. The grating of claim 5 , wherein the grating allows for an operation of the imaging apparatus in a focused geometry.

7. The grating of claim 6 , wherein the trenches are at least one of linear trenches, trapezoid trenches, and asymmetric trenches in focused geometry.

8. A phase contrast imaging apparatus for examining an object of interest, the apparatus comprising:
a source for emitting a beam of radiation;
a detector;
a grating positioned between the source and the detector;
wherein the detector is configured for detecting the radiation after it has passed the object of interest and the grating);
wherein the grating has a focused geometry;
wherein the grating has a primary axis which is arranged in a direction towards a source of radiation when the grating is installed in the imaging apparatus, the grating comprising:
a wafer material having inside:
a first trench having a depth in a first direction, the first direction being different from the primary axis, such that the first trench is tilted with respect to the primary axis, said grating comprising a substrate that has a surface perpendicular to said primary axis, the first trench being tilted by a first angle with respect to the primary axis; and
a second trench tilted by a second angle with respect to the primary axis, the first angle being smaller than the second angle,

said source serving as a focal spot of said radiation.

9. The imaging apparatus of claim 8 , said wafer material having inside: a sequence of trenches that includes the first and second trenches, wherein each trench of the sequence of trenches is tilted by a respective angle with respect to the primary axis, and wherein the respective angle increases from trench to trench.

10. The imaging apparatus of claim 9 , further comprising: a second grating which is an absorption grating positioned in front of the detector; wherein the second grating has also a focused geometry configured to the grating position.

11. The imaging apparatus of claim 10 , further comprising: a third grating which is an absorption grating having a trapezoid geometry and positioned between the source and the phase grating and which allows for an at least partially coherent illumination of the phase grating.

12. The imaging apparatus of claim 11 , further comprising: at least one actuator or stepper motor; wherein the beam of radiation emitted by the source has an optical axis; wherein the actuator or stepper motor is configured for at least one of moving at least one of the phase grating and the second grating perpendicular to the optical axis of the beam of radiation emitted by the source and changing an effective trench depth for the incident beam of radiation by tilting the grating to a certain angle.

13. The imaging apparatus of claim 11 , wherein the source is an x-ray source; and wherein the apparatus is configured as an x-ray based differential phase contrast imaging apparatus.

14. The grating of claim 3 , said radiation comprising radiation for phase contrast imaging by said apparatus.

15. The grating of claim 14 , said first trench having an inside surface disposed so as to face in a direction opposite to a direction of arrival of said radiation for phase contrast imaging.

16. The grating of claim 8 , said radiation comprising radiation for phase contrast imaging by said apparatus.

17. The grating of claim 16 , said first trench having an inside surface disposed so as to face in a direction opposite to a direction of arrival of said radiation for phase contrast imaging.

18. The method of claim 1 , said grating comprising a substrate that has a surface perpendicular to said primary axis, said wafer material having inside a second trench tilted by a second angle with respect to the primary axis, the first angle being smaller than the second angle.

19. The grating of claim 3 , the first and second trenches facing in respective directions that tilt toward said primary axis.

20. The grating of claim 19 , said grating having a focused geometry with respect to said spot.

21. The grating of claim 8 , the first and second trenches facing in respective directions that tilt toward said primary axis.

22. The grating of claim 21 , said focused geometry comprising a focused geometry with respect to said spot.

Assignees

• Vogtmeier Gereon
• Engel Klaus Juergen
• Koehler Thomas
• Roessl Ewald
• Koninkl Philips Nv

Inventors

• Vogtmeier Gereon
• Engel Klaus Juergen
• Koehler Thomas
• Roessl Ewald

Classifications

• G21K2207/005

  Methods and devices obtaining contrast from non-absorbing interaction of the radiation with matter, e.g. phase contrast · CPC title

• G21K2201/06

  using diffractive, refractive or reflecting elements · CPC title

• A61B6/484

  involving phase contrast X-ray imaging · CPC title

• G02B5/1857 Primary

  using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams · CPC title