Semiconductor device, and method of manufacturing semiconductor device

Patent metadata

Field	Value
Publication number	US-9347620-B2
Application number	US-201414151192-A
Country	US
Kind code	B2
Filing date	Jan 9, 2014
Priority date	Aug 8, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

First claim

What is claimed is:

1. A semiconductor device comprising:
a board comprising a first surface and a second surface opposite to the first surface, the first surface comprising a terminal;
a controller chip on the second surface of the board;
a semiconductor chip on the second surface of the board;
a sealing portion integrally covering the controller chip and the semiconductor chip, wherein the sealing portion does not cover a region of the second surface of the board; and
a component on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.

2. The device of claim 1 , wherein
the component is a light source whose light emission is to be checked from the outside of the semiconductor device.

3. The device of claim 1 , wherein
the region of the board is in an end of the board.

4. The device of claim 3 , wherein
the region of the board extends over an entire width of the board.

5. A semiconductor device comprising:
a board comprising a first surface and a second surface opposite to the first surface, the first surface comprising a terminal;
a controller chip on the second surface of the board;
a semiconductor chip on the second surface of the board;
a component on the second surface of the board;
a light transmitting portion on the second surface of the board, the light transmitting portion covering the component; and
a sealing portion integrally covering the controller chip, the semiconductor chip, and the light transmitting portion, the sealing portion exposing a part of the light transmitting portion to the outside of the sealing portion.

6. The device of claim 5 , wherein
the component is a light source whose light emission through the light transmitting portion is to be checked from the outside of the semiconductor device.

7. The device of claim 5 , wherein
the component is in an end of the board, and
the light transmitting portion is exposed from the end of the board to the outside of the sealing portion.

8. The device of claim 7 , wherein
the board comprises a cut-out passing through from the first surface to the second surface to expose the light transmitting portion to a side of the first surface.

9. The device of claim 5 , wherein
the board comprises a hole passing through from the first surface to the second surface to expose the light transmitting portion to a side of the first surface.

10. A method of manufacturing a semiconductor device comprising:
preparing a base member comprising boards;
arranging controller chips and semiconductor chips separately on both sides of a boundary line of the boards;
arranging components separately on the both sides of the boundary line in positions closer to the boundary line than the controller chips and the semiconductor chips;
forming a sealing portion so as to integrally cover the controller chips and the semiconductor chips and not to cover the components; and
cutting the base member along the boundary line.

11. The method of claim 10 wherein
each of the components is configured to perform an operation with respect to the outside of the semiconductor device.

12. The method of claim 10 wherein
each of the components is a light source whose light emission is to be checked from the outside of the semiconductor device.

13. The method of claim 10 wherein
the boards are arranged in the base member in a first direction and a second direction perpendicular to the first direction,
the boundary line extends in the second direction, and
a region not covered by the sealing portion continues extending over the plurality of boards in the second direction.

Assignees

• Toshiba Kk

Inventors

• Kogure Hideyuki
• Yamada Yuuta
• Ikuta Takeshi
• Hayakawa Toshiyuki
• Asada Junichi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/014

  using batch processing · CPC title