Method for manufacturing flexible substrate with surface structure copying from a template

Patent metadata

Field	Value
Publication number	US-9346196-B2
Application number	US-201213481857-A
Country	US
Kind code	B2
Filing date	May 27, 2012
Priority date	Aug 5, 2011
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

Disclosed herein are a flexible substrate with surface structure and a method for manufacturing the flexible substrate. The disclosure relates to a low-cost process to manufacturing the flexible substrate that is adapted to the large-area mass production. According to one of the embodiments in the disclosure, the method introduces a mold with surface structure. An isolation material is formed on the mold surface in an earlier stage. Upon the isolation layer, a flexible substrate material is coated. After that, a baking step is employed to cure the flexible substrate material. The flexible substrate with surface structure is therefore formed after de-molding the cured substrate. Another aspect to the disclosure adopts the above-formed substrate to be a base substrate. A second flexible substrate with the surface structure identical to the mold is then formed by performing the above steps.

First claim

What is claimed is:

1. A method for manufacturing a flexible substrate with surface structure, comprising:
preparing a molding plate with surface structure;
forming an isolation material on surface of the molding plate for forming an isolation layer;
coating a flexible substrate material on the isolation layer over the molding plate;
curing the flexible substrate material;
de-molding the cured flexible substrate material; and
forming the flexible substrate with surface structure.

2. The method of claim 1 , wherein the molding plate is substantially made of silicon oxide.

3. The method of claim 1 , wherein the isolation material is substantially made of silicide.

4. The method of claim 3 , wherein, a depositing process is introduced to forming the isolation material on the surface of the molding plate with surface structure.

5. The method of claim 1 , wherein the flexible substrate material is substantially made of polyimide.

6. The method of claim 1 , wherein the flexible substrate material is made of mixture substantially of organic polyimide and inorganic silicon oxide.

7. The method of claim 1 , wherein the step of curing is a baking process.

8. The method of claim 7 , wherein the baking step includes:
a first-stage baking under a temperature range of approximately 70 degree centigrade to 80 degree centigrade; and
a second-stage baking under a temperature range of approximately 150 degree centigrade to 200 degree centigrade.

9. The method of claim 8 , wherein the first-stage or the second-stage baking process takes about one hour.

10. The method of claim 7 , wherein the baking step includes:
a first-stage baking under a temperature of approximately 50 degree centigrade for around thirty minutes;
a second-stage baking under a temperature range of approximately 170 degree centigrade to 250 degree centigrade for around thirty minutes; and
a third-stage baking under a temperature of approximately 210 degree centigrade for around one hour.

11. The method of claim 1 , further comprising a pressing step for compacting the flexible substrate material, the isolation material, and the molding plate with surface structure after the step of coating the flexible substrate material.

12. The method of claim 1 , further comprising:
adhering the formed flexible substrate with surface structure to a hard substrate;
forming a second isolation material on surface of the flexible substrate with surface structure;
coating a second flexible substrate material on the second isolation material;
curing the second flexible substrate material;
de-molding the cured second flexible substrate material; and
forming a second flexible substrate with surface structure.

13. The method of claim 12 , wherein the second isolation material is substantially made of silicide.

14. The method of claim 12 , wherein the second flexible substrate material is substantially made of polyimide, or mixture of organic polyimide and inorganic silicon oxide.

15. The method of claim 12 , wherein the curing step is a baking process comprising:
a first-stage baking under a temperature range of approximately 70 degree centigrade to 80 degree centigrade; and
a second-stage baking under a temperature range of approximately 150 degree centigrade to 200 degree centigrade.

16. The method of claim 12 , wherein the curing is a baking process comprising:
a first-stage baking under a temperature of approximately 50 degree centigrade for around thirty minutes;
a second-stage baking under a temperature range of approximately 170 degree centigrade to 250 degree centigrade for around thirty minutes; and
a third-stage baking under a temperature of approximately 210 degree centigrade for around one hour.

17. The method of claim 12 , further comprising a pressing step for compacting the second flexible substrate material, the second isolation material, the flexible substrate with surface structure, and the hard substrate adhered to the flexible substrate after coating the second flexible substrate material.

Assignees

• Lee Si-Chen
• Yang Chieh-Hung
• Hsueh Chun-Yuan
• Univ Nat Taiwan

Inventors

• Lee Si-Chen
• Yang Chieh-Hung
• Hsueh Chun-Yuan

Classifications

• B29C41/38

  Moulds, cores or other substrates · CPC title

• B29C33/424

  Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title

• B29C41/36 Primary

  Feeding the material on to the mould, core or other substrate · CPC title

• Y10T428/24479

  including variation in thickness · CPC title