Polycrystalline diamond compacts and applications therefor

US9346149B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9346149-B1
Application numberUS-201313734354-A
CountryUS
Kind codeB1
Filing dateJan 4, 2013
Priority dateJan 4, 2013
Publication dateMay 24, 2016
Grant dateMay 24, 2016

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 μm to about 22 μm. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.

First claim

Opening claim text (preview).

What is claimed is: 1. A polycrystalline diamond compact, comprising: a substrate; and a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween, the plurality of diamond grains including: a first amount being about 35 volume % to about 45 volume % of the plurality of diamond grains, the first amount exhibiting a first average grain size of about 8 μm to about 14 μm; and a second amount being about 55 volume % to about 65 volume % of the plurality of diamond grains, the second amount exhibiting a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm. 2. The polycrystalline diamond compact of claim 1 wherein the first average grain size is about 10 μm to about 12 μm and the second average grain size is about 18 μm to about 22 μm. 3. The polycrystalline diamond compact of claim 1 wherein the first amount is about 38 volume % to about 42 volume % and the second amount is about 58 volume % to about 62 volume %. 4. The polycrystalline diamond compact of claim 3 wherein the first average grain size is about 10 μm to about 12 μm and the second average grain size is about 18 μm to about 22 μm. 5. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table includes boron in a range from greater than 0 weight % to about 5 weight %. 6. The polycrystalline diamond compact of claim 5 wherein the range is from greater than 0 weight % to about 0.2 weight %. 7. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table is integrally formed with the substrate. 8. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table includes at least one exterior surface and a leached region extending inwardly from of the at least one exterior surface to a depth of greater than 250 μm. 9. A rotary drill bit, comprising: a bit body including a leading end structure configured to facilitate drilling a subterranean formation and having one or more blades; and a plurality of cutting elements mounted to the one or more blades, at least one of the plurality of cutting elements including: a substrate; and a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween, the plurality of diamond grains including: a first amount exhibiting a first average grain size of about 8 μm to about 14 μm; and a second amount exhibiting a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm; wherein the first amount is about 35 volume % to about 45 volume % and the second amount is about 55 volume % to about 65 volume %; or the first amount is about 55 volume % to about 65 volume % and the second amount is about 35 volume % to about 45 volume %. 10. A polycrystalline diamond compact, comprising: a substrate; and a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween, the plurality of diamond grains including: a first amount being about 55 volume % to about 65 volume % of the plurality of diamond grains, the first amount exhibiting a first average grain size of about 8 μm to about 14 μm; and a second amount being about 35 volume % to about 45 volume % of the plurality of diamond grains, the second amount exhibiting a second average grain size that is greater than the first average grain size and is about 20 μm to about 40 μm; wherein a ratio of the first average grain size to the second average grain size is about 0.3 to about 0.7. 11. A polycrystalline diamond compact, comprising: a substrate; and a polycrystalline diamond table bonded to the substrate, the polycrystalline diamond table including a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween, the plurality of diamond grains including: a first amount being about 55 volume % to about 65 volume % of the plurality of diamond grains, the first amount exhibiting a first average grain size of about 8 μm to about 14 μm; and a second amount being about 35 volume % to about 45 volume % of the plurality of diamond grains, the second amount exhibiting a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm. 12. The polycrystalline diamond compact of claim 11 wherein the first average grain size is about 10 μm to about 12 μm and the second average grain size is about 18 μm to about 22 μm. 13. The polycrystalline diamond compact of claim 11 wherein the first amount is about 58 volume % to about 62 volume % and the second amount is about 38 volume % to about 42 volume %. 14. The polycrystalline diamond compact of claim 13 wherein the first average grain size is about 10 μm to about 12 μm and the second average grain size is about 18 μm to about 22 μm. 15. The polycrystalline diamond compact of claim 11 wherein the first amount is about 60 volume % and the second amount is about 40 volume %, and wherein the first average grain size is about 12 μm and the second average grain size is about 20 μm. 16. The polycrystalline diamond compact of claim 11 wherein the polycrystalline diamond table includes boron in an amount from greater than 0 weight % to about 5 weight %. 17. The polycrystalline diamond compact of claim 16 wherein the amount is from greater than 0 weight % to about 0.2 weight %. 18. The polycrystalline diamond compact of claim 11 wherein the polycrystalline diamond table is integrally formed with the substrate. 19. The polycrystalline diamond compact of claim 11 wherein the polycrystalline diamond table includes at least one exterior surface and a leached region extending inwardly from of the at least one exterior surface to a depth of greater than 250 μm.

Assignees

Inventors

Classifications

  • Diamond · CPC title

  • using moulds or presses · CPC title

  • Segments of abrasive wheels · CPC title

  • Joining of crystals · CPC title

  • B24D3/10Primary

    for porous or cellular structure, e.g. for use with diamonds as abrasives · CPC title

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What does patent US9346149B1 cover?
Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount bein…
Who is the assignee on this patent?
Us Synthetic Corp
What technology area does this patent fall under?
Primary CPC classification B24D3/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 24 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).