Portable electrostatic chuck carrier for thin substrates

Patent metadata

Field	Value
Publication number	US-9343347-B2
Application number	US-201314018959-A
Country	US
Kind code	B2
Filing date	Sep 5, 2013
Priority date	Sep 7, 2012
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

Embodiments of a portable electrostatic chuck for use in a substrate process chamber to support an ultra-thin substrate when disposed thereon are provided herein. In some embodiments, a portable electrostatic chuck may include a carrier comprising a dielectric material; an electrically conductive layer disposed on a top surface of the carrier; a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and at least one conductor coupled to the electrically conductive layer, wherein the portable electrostatic chuck is configured to electrostatically retain the ultra-thin substrate to the portable electrostatic chuck, wherein the portable electrostatic chuck is further configured to be handled and moved by substrate processing equipment outside of the substrate process chamber, and wherein the portable electrostatic chuck is sized to support large ultra-thin substrates.

First claim

The invention claimed is:

1. A portable electrostatic chuck for use in a substrate process chamber to support an ultra-thin substrate when disposed thereon, comprising:
a carrier comprising a dielectric material;
an electrically conductive layer disposed on a top surface of the carrier;
a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and
at least one conductor coupled to the electrically conductive layer,
wherein the portable electrostatic chuck is configured to electrostatically retain the ultra-thin substrate to the portable electrostatic chuck, wherein the portable electrostatic chuck is further configured to be handled and moved by substrate processing equipment outside of the substrate process chamber, and wherein the portable electrostatic chuck is sized to support large ultra-thin substrates.

2. The portable electrostatic chuck of claim 1 , wherein the portable electrostatic chuck and the large ultra-thin substrates are rectangular.

3. The portable electrostatic chuck of claim 1 , wherein the portable electrostatic chuck is about 500 mm square to about 3 meters square.

4. The portable electrostatic chuck of claim 1 , wherein the carrier is configured to provide sufficient stiffness to the portable electrostatic chuck such that when the ultra-thin substrate is disposed on the portable electrostatic chuck, the ultra-thin substrate can be processed as a sheet in the one or more process chambers.

5. The portable electrostatic chuck of claim 1 , wherein a thickness of the portable electrostatic chuck is between about 0.4 mm to about 0.7 mm.

6. The portable electrostatic chuck of claim 5 , wherein a thickness of the carrier is less than 0.7 mm by about 10 to 200 microns.

7. The portable electrostatic chuck of claim 1 , wherein the carrier is fabricated from at least one of glass, aluminum oxide (Al 2 O 3 ), aluminum nitride (AlN), silicon (Si), stainless steel, aluminum, ceramic, or nickel iron alloys having a low coefficient of thermal expansion.

8. The portable electrostatic chuck of claim 1 , wherein the carrier comprises a material that has a substantially equivalent coefficient of thermal expansion as the ultra-thin substrate to be processed.

9. The portable electrostatic chuck of claim 1 , wherein each of the carrier, the electrically conductive layer, and the dielectric layer include gas diffusion holes formed therethrough that fluidly couple a bottom surface of the carrier with a top surface of the dielectric layer.

10. The portable electrostatic chuck of claim 9 , wherein the gas diffusion holes of each of the carrier, the electrically conductive layer, and the dielectric layer are between 30 microns and 300 microns in diameter.

11. The portable electrostatic chuck of claim 1 , further comprising a portable battery power source coupled to the at least one conductor to provide a bias to the portable electrostatic chuck relative to the ultra-thin substrate which electrostatically retains the ultra-thin substrate to the portable electrostatic chuck.

12. The portable electrostatic chuck of claim 1 , wherein the at least one conductor is configured to be coupled to one or more power charging stations located outside the one or more processing chambers to provide a bias to the portable electrostatic chuck relative to the ultra-thin substrate which electrostatically retains the ultra-thin substrate to the portable electrostatic chuck during substrate processing within the one or more process chambers.

13. A method for handling an ultra-thin substrate to be processed in one or more process chambers, the method comprising:
disposing the ultra-thin substrate on a portable electrostatic chuck disposed outside the one or more process chambers, the portable electrostatic chuck comprising:
a carrier comprising a dielectric material;
an electrically conductive layer disposed on a top surface of the carrier;
a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and
at least one electrode coupled to the electrically conductive layer, wherein the portable electrostatic chuck is sized to support large ultra-thin substrates;

applying a first power to the electrode to provide a bias to the portable electrostatic chuck relative to the ultra-thin substrate which electrostatically retains the ultra-thin substrate to the portable electrostatic chuck;
moving the portable electrostatic chuck and electrostatically retained ultra-thin substrate into a first process chamber through an opening in the first process chamber to perform a first set of one or more substrate processes;
removing the portable electrostatic chuck and electrostatically retained ultra-thin substrate from the first process chamber through the opening in the first process chamber after the first set of substrate processes is performed; and
performing a de-chucking process to release the ultra-thin substrate from the portable electrostatic chuck.

14. The method of claim 13 , wherein the portable electrostatic chuck is about 500 mm square to about 3 meters square.

15. The method of claim 13 , wherein the method further includes:
applying a second power to ensure that the ultra-thin substrate is electrostatically retained to the portable electrostatic chuck; and
moving the portable electrostatic chuck and electrostatically retained ultra-thin substrate into a second process chamber.

16. The method of claim 15 , wherein the first power is applied to the portable electrostatic chuck at an initial power charging station, and wherein the second power is applied to the portable electrostatic chuck at an intermediate power charging station.

17. The method of claim 13 , wherein the ultra-thin substrate is glass substrate with a thickness of between about 10 to 200 microns.

18. The method of claim 13 , wherein the de-chucking process includes:
providing a gas between the portable electrostatic chuck and the ultra-thin substrate to release the ultra-thin substrate from the portable electrostatic chuck.

19. The method of claim 18 , wherein the gas is a charged ionized plasma, and wherein the charged ionized plasma reduces a chucking force by reducing an accumulated charge on the ultra-thin substrate.

20. An apparatus for unloading an ultra-thin substrate comprising:
a portable electrostatic chuck comprising:
a carrier comprised of a dielectric material;
an electrically conductive layer disposed on a top surface of the carrier;
a dielectric layer having a support surface, wherein the dielectric layer is disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and
a plurality of gas diffusion holes formed through the carrier, the electrically conductive layer, and the dielectric layer that fluidly couple a bottom surface of the carrier to the support surface of the dielectric layer; and

a pedestal support having a support surface that supports the portable electrostatic chuck when disposed thereon, the substrate comprising:
a body;
a gas reservoir disposed in the body; and
a plurality of gas diffusion holes that fluidly couple the gas reservoir to the support surface, wherein the plurality of gas diffusion holes of the support surface align with the plurality of gas diffusion holes of the portable electrostatic chuck.

Assignees

• Applied Materials Inc

Inventors

• Haas Dieter
• Foad Majeed A
• Hofmann Ralf

Classifications

• H10P72/72 Primary

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H01L21/6831

  Electricity · mapped topic

• H01L21/6833 Primary

  Electricity · mapped topic