Manufacturing method of circuit board

Patent metadata

Field	Value
Publication number	US-9340003-B2
Application number	US-201313919711-A
Country	US
Kind code	B2
Filing date	Jun 17, 2013
Priority date	May 19, 2010
Publication date	May 17, 2016
Grant date	May 17, 2016

Abstract

A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

First claim

What is claimed is:

1. A manufacturing method of a circuit board, comprising:
providing a first core layer, a second core material layer, and a central dielectric material layer, wherein the first core layer comprises a core dielectric layer and a core circuit layer, the core circuit layer is disposed on the core dielectric layer and has a laser resistant pattern, the laser resistant pattern is located at a boundary of the pre-removing area, the laser resistant pattern is a portion of the core circuit layer and is physically independent from the rest of the core circuit layer, the second core material layer is disposed on the first core layer, and the central dielectric material layer is disposed between the first core layer and the second core material layer;
pressing the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure, wherein a pre-removing area is defined on the composite circuit structure, and at least a portion of the core circuit layer is located within the pre-removing area;
removing a portion of the central dielectric material layer located at the boundary of the pre-removing area and a portion of the second core material layer located at the boundary of the pre-removing area by laser etching; and
removing a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

2. The manufacturing method according to claim 1 , wherein the step of pressing the first core layer, the second core material layer, and the central dielectric material layer further comprises:
pressing a first dielectric material layer and a first conductive layer onto the first core layer, wherein the first dielectric material layer is located between the first core layer and the first conductive layer;
pressing a second dielectric material layer and a second conductive layer onto the second core layer, wherein the second dielectric material layer is located between the second core layer and the second conductive layer; and
patterning the first conductive layer and the second conductive layer to form a first circuit layer and a second circuit layer.

3. The manufacturing method according to claim 2 further comprising:
when removing the portion of the central dielectric material layer located at the boundary of the pre-removing area and the portion of the second core material layer located at the boundary of the pre-removing area, removing a portion of the second dielectric material layer located at the boundary of the pre-removing area; and
when removing the portion of the central dielectric material layer located within the pre-removing area and the portion of the second core material layer located within the pre-removing area, removing a portion of the second dielectric material layer located within the pre-removing area to form a second dielectric layer.

4. The manufacturing method according to claim 1 further comprising performing an etching process or a mechanical processing to remove the laser resistant pattern.

5. The manufacturing method according to claim 1 , wherein the technique of removing the portion of the central dielectric material layer located within the pre-removing area and the portion of the second core material layer located within the pre-removing area comprises a lift-off technique.

6. The manufacturing method according to claim 1 , wherein the first core layer further comprises:
a protection layer, covering the portion of the core circuit layer located within the pre-removing area.

7. The manufacturing method according to claim 6 further comprising:
when or after removing the portion of the central dielectric material layer located within the pre-removing area and the portion of the second core material layer located within the pre-removing area, removing the protection layer.

Assignees

• Unimicron Technology Corp

Inventors

• Chang Chen-Chuan

Classifications

• H10W70/682

  comprising holes having chips therein · CPC title

• Y10T156/1052

  with cutting, punching, tearing or severing · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• B32B38/10 Primary

  Removing layers, or parts of layers, mechanically or chemically · CPC title