3D shielding case and methods for forming the same

Patent metadata

Field	Value
Publication number	US-9337073-B2
Application number	US-201313926938-A
Country	US
Kind code	B2
Filing date	Jun 25, 2013
Priority date	Mar 12, 2013
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh.

First claim

What is claimed is:

1. A package comprising:
a die;
a first Through-Assembly Via (TAV) laterally separated from and electrically coupled to the die; and
a metal shield case comprising:
a first metal mesh; and
a second Through-Assembly Via (TAV) over the first metal mesh, wherein the second TAV forms a ring around the first TAV and the die, the second TAV laterally separated from the first TAV and the die, wherein the second TAV and the first metal mesh are electrically interconnected and electrically grounded, and wherein the first TAV is electrically isolated from the first metal mesh.

2. The package of claim 1 , wherein the metal shield case further comprises:
a second metal mesh over the second TAV and electrically connected to the second TAV and the first metal mesh.

3. The package of claim 2 further comprising:
a plurality of Under-Bump Metallurgies (UBMs) at a same level, and formed of a same material, as the second metal mesh; and
a solder region connected to each of the plurality of UBMs.

4. The package of claim 3 , wherein the plurality of UBMs comprises:
first UBMs electrically disconnected from the second metal mesh; and
second UBMs electrically grounded, wherein the second UBMs are integrated portions of the second metal mesh.

5. The package of claim 1 further comprising a plurality of metal pads at a same level, and formed of a same material, as the first metal mesh, wherein each of the plurality of metal pads is encircled by the first metal mesh.

6. The package of claim 5 , wherein each of the plurality of metal pads is separated from all remaining ones of the plurality of metal pads by the first metal mesh.

7. A package comprising:
a metal shield case comprising:
a first metal mesh;
a plurality of metal pads at a same level, and of a same material, as the first metal mesh, wherein each of the plurality of metal pads is encircled by the first metal mesh;
a second metal mesh underlying the first metal mesh; and
a Through-Assembly Via (TAV) forming a ring, wherein the TAV has a top end in contact with a bottom surface of the first metal mesh, and wherein the TAV is over the second metal mesh; and

a metal shielding film over the metal shield case, wherein the metal shielding film comprises:
a top portion over, and spaced apart from, the first metal mesh; and
a sidewall portion contacting edges of the first metal mesh and edges of the second metal mesh.

8. The package of claim 7 , wherein each of the plurality of metal pads is separated from all remaining ones of the plurality of metal pads by the first metal mesh.

9. The package of claim 7 further comprising:
a first die in the metal shield case; and
a first molding material molding the first die therein, wherein one of the plurality of metal pads is electrically connected to the first die.

10. The package of claim 9 further comprising:
a second die over the metal shield case and underlying the metal shielding film; and
a second molding material molding the second die therein, wherein the sidewall portion contacting sidewalls of the metal shielding film further contacts sidewalls of the second molding material.

11. The package of claim 9 further comprising a plurality of TAVs in the first molding material, wherein each of the plurality of TAVs is underlying and connected to one of the plurality of metal pads.

12. The package of claim 7 further comprising:
a plurality of Under-Bump Metallurgies (UBMs) at a same level, and formed of a same material, as the second metal mesh; and
a solder region connected to each of the plurality of UBMs.

13. The package of claim 12 , wherein the plurality of UBMs comprises:
first UBMs electrically disconnected from the second metal mesh; and
second UBMs electrically grounded, wherein the second UBMs are integrated portions of the second metal mesh.

14. The package of claim 7 , wherein the metal shielding film comprises metal particles embedded in an adhesive.

15. A package comprising:
a first die encapsulated in a first molding material, the first molding material having a first side and a second side opposite the first side;
a Through-Assembly Via (TAV) ring encapsulated in the first molding material, the TAV ring encircling the first die;
a first redistribution layer (RDL) disposed at the first side of the molding compound; and
a first metal mesh and an Under-Bump Metallurgy (UBM) disposed at a side of the first RDL facing away from the molding compound, the first metal mesh and the UBM electrically coupled to the TAV ring through the first RDL.

16. The package of claim 15 , further comprising:
a second metal mesh disposed at the second side of the molding compound and electrically coupled to the TAV ring.

17. The package of claim 15 , further comprising:
a metal post encapsulated in the first molding compound, the metal post disposed in a region of the first molding compound between the first die and the TAV ring.

18. The package of claim 17 , wherein the metal post and the TAV ring are physically and electrically disconnected from each other.

19. The package of claim 15 , further comprising:
a second redistribution layer (RDL) disposed at the second side of the molding compound and electrically coupled to the first die; and
a second die encapsulated in a second molding material disposed at a side of the second RDL facing away from the first die, the second die electrically coupled to the second RDL.

20. The package of claim 19 , further comprising a metal shielding film contacting a surface of the second die facing away from the first die and an edge of the first metal mesh.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Liu Monsen
• Wang Chuei-Tang
• Chih Lai Wei
• Yu Chen-Hua

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title