Grindstone tool and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-9333627-B2
Application number	US-201214129036-A
Country	US
Kind code	B2
Filing date	Feb 24, 2012
Priority date	Sep 2, 2011
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

Provided is a grindstone tool capable of grinding with high precision and a method for manufacturing same, the grindstone tool having improved chip discharge characteristics to thereby prevent chips clogging of the chip pocket. The grinding tool comprises: dimples ( 14 ) formed in the external peripheral surface ( 13 a ) of a base metal ( 11 ) so that the quantity present in any position in the width direction of the external peripheral surface ( 13 a ) is the same in the peripheral direction; a grinding surface ( 21 ) formed by affixing a plurality of abrasive grains ( 22 ) to the external peripheral surface ( 13 a ) using a plating layer ( 23 ); and recess parts ( 24 ) into which chips produced by the grinding of the abrasive grains ( 22 ) are discharged, the recess parts being formed by portions that correspond to the dimples ( 14 ) in the grinding surface ( 21 ) being recessed.

First claim

The invention claimed is:

1. A grindstone tool, comprising:
dimples formed in an external peripheral surface of a base metal such that the same number of the dimples are scattered in a circumferential direction of the external peripheral surface at any position in a width direction of the external peripheral surface;
a grinding surface formed by affixing a plurality of abrasive grains on the external peripheral surface by using a plating layer; and
recesses into which chips produced by grinding with the abrasive grains are to be discharged, the recesses being formed by recessing portions corresponding to the dimples in the grinding surface,
wherein the dimples are inclined such that an opening portion of each dimple is located upstream of a bottom portion thereof in a rotation direction,
the recesses are recessed in such a manner as to correspond to the inclination of the dimples, and
the abrasive grains are also affixed to a surface of each dimple by using the plating layer so as to protrude from the surface of each dimple.

Assignees

• Arisawa Hideaki
• Kimura Toshio
• Mitsubishi Heavy Ind Machine Tool Co Ltd

Inventors

• Arisawa Hideaki
• Kimura Toshio

Classifications

• B24D18/0054 Primary

  by impressing abrasive powder in a matrix · CPC title

• B24D5/00

  Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor · CPC title

• B24D3/06

  metallic {or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements} · CPC title