Printed chemical mechanical polishing pad having abrasives therein and system for printing

US10016877B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10016877-B2
Application numberUS-201615243571-A
CountryUS
Kind codeB2
Filing dateAug 22, 2016
Priority dateNov 4, 2013
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A plurality of layers of the particles is successively deposited according to the desired distribution with the 3D printer. The polymer matrix precursor is solidified into a polymer matrix having the particles embedded in the desired distribution.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for fabricating a polishing layer of a polishing pad, comprising: a support; a printer to form the polishing layer on the support, the printer including at least one nozzle, wherein the printer is configured successively deposit a plurality of layers of a polymer matrix by ejecting droplets of a liquid polymer matrix precursor and dispensing particles to be embedded in the polymer matrix to form the polishing layer; and a computer coupled to the printer and configured to receive a computer-readable file containing data setting a desired distribution of particles to be embedded within the polymer matrix of the polishing layer, and control the printer in response to the data setting the desired distribution of particles so that successively depositing the plurality of layers includes distributing the particles in the plurality of layers according to the desired distribution with the printer. 2. The apparatus of claim 1 , comprising a supply of liquid polishing pad material precursor and a supply of the particles. 3. The apparatus of claim 2 , wherein the particles are abrasive particles. 4. The apparatus of claim 2 , wherein the particles have a hollow core such that the polishing layer comprises pores formed by the hollow core of particles. 5. The apparatus of claim 1 , comprising a mixer to mix the particles with the liquid polymer matrix precursor to form a mixture that is ejected by the at least one nozzle. 6. The apparatus of claim 1 , wherein the printer comprises a first printhead to eject the liquid polymer matrix precursor and a second printhead to eject the particles. 7. The apparatus of claim 6 , wherein the printer is configured such that the first printhead ejects the liquid polymer matrix precursor before the second printhead dispenses the particles into the liquid polymer matrix precursor. 8. The apparatus of claim 1 , comprising a radiation source to cure the polymer matrix precursor to form a solidified polymer matrix having the particles embedded in the desired distribution. 9. The apparatus of claim 8 , wherein the radiation source comprises a UV radiation source. 10. The apparatus of claim 8 , wherein the radiation source is configured to cure the polymer matrix precursor immediately upon deposition. 11. The apparatus of claim 8 , wherein the radiation source is configured to cure an entire layer of polymer matrix precursor simultaneously after deposition of the entire layer. 12. The apparatus of claim 8 , comprising a supply of the polymer matrix precursor, wherein the polymer matrix precursor is a liquid thermoset polymer precursor. 13. The apparatus of claim 1 , comprising a supply of the polymer matrix precursor, wherein the polymer matrix precursor is a molten thermoplastic polymer. 14. The apparatus of claim 1 , wherein the nozzle is configured to translate across the support. 15. The apparatus of claim 1 , wherein the support forms a portion of the polishing pad.

Assignees

Inventors

Classifications

  • for controlling or regulating additive manufacturing processes · CPC title

  • Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title

  • Processes of additive manufacturing · CPC title

  • by impressing abrasive powder in a matrix · CPC title

  • Pads with fixed abrasives · CPC title

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Frequently asked questions

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What does patent US10016877B2 cover?
A method of fabricating a polishing layer of a polishing pad includes determining a desired distribution of particles to be embedded within a polymer matrix of the polishing layer. A plurality of layers of the polymer matrix is successively deposited with a 3D printer, each layer of the plurality of layers of polymer matrix being deposited by ejecting a polymer matrix precursor from a nozzle. A…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24D18/0054. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).