Semiconductor device and method of forming RDL and vertical interconnect by laser direct structuring

Patent metadata

Field	Value
Publication number	US-9330994-B2
Application number	US-201414228531-A
Country	US
Kind code	B2
Filing date	Mar 28, 2014
Priority date	Mar 28, 2014
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A semiconductor device has a semiconductor die and encapsulant deposited over the semiconductor die. An insulating layer is formed over the semiconductor die and encapsulant. A first channel including a first conductive surface is formed in the insulating layer by laser radiation. A laser-activated catalyst is infused in the insulating layer to form the first conductive surface in the first channel upon laser radiation. A vertical interconnect is formed through the encapsulant. A first conductive layer is formed in the first channel over the first conductive surface. A second channel including a second conductive surface is formed in the encapsulant by laser radiation. The catalyst is infused in the encapsulant to form the second conductive surface in the second channel upon laser radiation. A second conductive layer is formed in the second channel over the second conductive surface. An interconnect structure is formed over the first conductive layer.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an encapsulant over the semiconductor die;
forming an insulating layer over the semiconductor die and encapsulant;
forming a first channel and first conductive surface in the insulating layer by a first laser radiation;
infusing a first catalyst in the insulating layer to form the first conductive surface upon the first laser radiation;
forming a first conductive layer in the first channel over the first conductive surface; and
forming a second channel and second conductive surface in the encapsulant by a second laser radiation.

2. The method of claim 1 , further including:
infusing a second catalyst in the encapsulant to form the second conductive surface upon the second laser radiation; and
forming a second conductive layer in the second channel over the second conductive surface.

3. The method of claim 1 , further including forming a vertical interconnect through the encapsulant.

4. The method of claim 1 , further including forming a conductive pillar over the semiconductor die.

5. The method of claim 1 , further including forming a bump over the semiconductor die.

6. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an encapsulant over the semiconductor die;
forming a first channel and first conductive surface in the encapsulant by a first laser radiation;
infusing a first catalyst in the encapsulant to form the first conductive surface upon the first laser radiation; and
forming a first conductive layer in the first channel over the first conductive surface.

7. The method of claim 6 , further including:
forming an insulating layer over the semiconductor die;
forming a second channel in the insulating layer by a second laser radiation; and
forming a second conductive layer in the second channel.

8. The method of claim 7 , further including infusing a second catalyst in the insulating layer to form a second conductive surface in the second channel upon the second laser radiation.

9. The method of claim 6 , further including forming an interconnect structure over the first conductive layer.

10. The method of claim 6 , further including forming a conductive pillar over the semiconductor die.

11. The method of claim 6 , further including forming a bump over the semiconductor die.

12. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an insulating material over the semiconductor die;
forming a first conductive surface in the insulating material by a first laser radiation;
infusing a first catalyst in the insulating material to form the first conductive surface upon the first laser radiation; and
forming a first conductive layer over the first conductive surface.

13. The method of claim 12 , further including:
forming an insulating layer over the semiconductor die;
infusing a second catalyst in the insulating layer to form a second conductive surface in the insulating layer upon a second laser radiation; and
forming a second conductive layer over the second conductive surface.

14. The method of claim 12 , further including forming an interconnect structure over the first conductive layer.

15. The method of claim 12 , further including forming a vertical interconnect through the insulating material.

16. The method of claim 12 , further including forming a conductive pillar over the semiconductor die.

17. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an insulating material over the semiconductor die;
forming a first conductive surface in the insulating material using a first laser radiation; and
infusing a catalyst in the insulating material to form the first conductive surface upon the first laser radiation.

18. The method of claim 17 , further including forming a conductive layer over the first conductive surface.

19. The method of claim 18 , wherein the conductive layer extends above a surface of the insulating material.

20. The method of claim 17 , further including:
forming an insulating layer over the semiconductor die; and
forming a second conductive surface in the insulating layer by a second laser radiation; and
forming a conductive layer over the second conductive surface.

21. The method of claim 17 , further including forming a vertical interconnect through the insulating material.

Assignees

• Stats Chippac Ltd

Inventors

• Camacho Zigmund R
• Liao Bartholomew
• Alvarez Sheila Marie L
• Chi Heejo
• Dao Kelvin

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W72/874

  On different surfaces · CPC title