Methods of manufacture for micro-electro-mechanical system (MEMS)

Patent metadata

Field	Value
Publication number	US-9330856-B2
Application number	US-97785010-A
Country	US
Kind code	B2
Filing date	Dec 23, 2010
Priority date	Jun 25, 2010
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.

First claim

What is claimed:

1. A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
forming a beam structure;
forming an electrode directly on a top surface of an insulator layer, remote from the beam structure;
forming at least one sacrificial layer over the beam structure, and remote from the electrode;
forming a lid structure over the at least one sacrificial layer and the electrode;
providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode;
venting the sacrificial layer to form a cavity;
sealing the vent hole with material; and
forming a final via in the lid structure to the electrode, through the partial via,
wherein the partial via has a larger cross section diameter than the final via.

2. The method of claim 1 , further comprising:
forming a sacrificial material on discrete wires;
forming the beam structure on the sacrificial material;
forming the insulator layer over the sacrificial material; and
forming a cavity via in the insulator layer, exposing a portion of the sacrificial material, wherein:
the sacrificial layer is formed in the cavity via; and
the venting comprises venting the sacrificial material and the sacrificial layer to form at least a lower cavity and an upper cavity, respectively.

3. A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
forming a beam structure;
forming an electrode on an insulator layer, remote from the beam structure;
forming at least one sacrificial layer over the beam structure, and remote from the electrode;
forming a lid structure over the at least one sacrificial layer and the electrode;
providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode;
venting the sacrificial layer to form a cavity;
sealing the vent hole with material;
forming a final via in the lid structure to the electrode, through the partial via;
forming a sacrificial material on discrete wires;
forming the beam structure on the sacrificial material;
forming the insulator layer over the sacrificial material; and
forming a cavity via in the insulator layer, exposing a portion of the sacrificial material wherein:
the partial via has a larger cross section diameter than the final via;
the sacrificial layer is formed in the cavity via;
the venting comprises venting the sacrificial material and the sacrificial layer to form at least a lower cavity and an upper cavity, respectively;
the sealing the vent hole with material includes depositing the material on a surface of the partial via; and
forming the final via includes etching through the material in the partial via and continuing to etch the lid structure to the electrode.

4. The method of claim 1 , wherein the sealing the vent hole comprises depositing dielectric material, which covers a surface of the lid structure within the partial via.

5. A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
forming a beam structure;
forming an electrode on an insulator layer, remote from the beam structure;
forming at least one sacrificial layer over the beam structure, and remote from the electrode;
forming a lid structure over the at least one sacrificial layer and the electrode;
providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode;
venting the sacrificial layer to form a cavity;
sealing the vent hole with material; and
forming a final via in the lid structure to the electrode, through the partial via, wherein:
the partial via has a larger cross section diameter than the final via;
the sealing the vent hole comprises depositing dielectric material, which covers a surface of the lid structure within the partial via; and
the forming the final via includes etching through the dielectric material within the partial via.

6. The method of claim 5 , further comprising forming a nitride cap on the dielectric material, including within the partial via.

7. The method of claim 6 , wherein the forming the final via includes etching through the nitride cap within the partial via.

8. A method of forming at least one Micro-Electro-Mechanical System (MEMS), comprising:
forming a beam structure;
forming an electrode on an insulator layer, remote from the beam structure;
forming at least one sacrificial layer over the beam structure, and remote from the electrode;
forming a lid structure over the at least one sacrificial layer and the electrode;
providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode;
venting the sacrificial layer to form a cavity;
sealing the vent hole with material;
forming a final via in the lid structure to the electrode, through the partial via;
forming a nitride cap on dielectric material, including within the partial via; and
forming polyimide material on the nitride cap within the partial via,
wherein the forming of the final via includes etching through an opening in the polymide material and within the partial via,
the sealing the vent hole comprises depositing the dielectric material, which covers a surface of the lid structure within the partial via,
the forming the final via includes etching through the dielectric material within the partial via, and
the forming the final via includes etching through the nitride cap within the partial via.

9. The method of claim 8 , wherein the opening formed from the polyimide is smaller than an opening formed in the lid structure to cover corners of the dielectric material and nitride cap wire corner.

10. The method of claim 1 , wherein the partial via and the final via are coincident with one another.

11. The method of claim 1 , wherein an angle of the final via is tapered.

12. The method of claim 1 , wherein the vent hole is rounded or chamfered.

13. The method of claim 1 , wherein the vent hole is octagonal.

14. The method of claim 1 , wherein the vent hole is chamfered at a 45 degree angle.

Assignees

• Herrin Russell T
• Maling Jeffrey C
• Stamper Anthony K
• IBM

Inventors

• Herrin Russell T
• Maling Jeffrey C
• Stamper Anthony K

Classifications

• Y10T29/49155

  Manufacturing circuit on or in base · CPC title

• H01H2057/006

  Micromechanical piezoelectric relay · CPC title

• H01H57/00

  Electrostrictive relays; Piezoelectric relays · CPC title

• B81C2203/0136

  Growing or depositing of a covering layer · CPC title

• B81C1/00476 Primary

  removing a sacrificial layer (B81C1/00912 takes precedence) · CPC title