Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Patent metadata

Field	Value
Publication number	US-9324733-B2
Application number	US-201414220910-A
Country	US
Kind code	B2
Filing date	Mar 20, 2014
Priority date	Jun 4, 2004
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

First claim

We claim:

1. A multilayer device comprising:
a flexible substrate;
an intermediate layer that is supported on a surface of the flexible substrate;
a first device layer disposed over the flexible substrate and at least partially embedded in the intermediate layer, the first device layer comprising:
a first device component that forms part of a two-dimensional array;
at least two stretchable interconnects, each of the at least two stretchable interconnects having a first end, a second end, and a central portion that is between the first and the second end, wherein:
the at least two stretchable interconnects extend along at least two different directions from the first device component in a plane of the supporting surface to form the two dimensional array;
the first end of each of the at least two stretchable interconnects is in electrical communication with the first device component;
the central portion of each of the at least two stretchable interconnects comprises a bent configuration region;

an interlayer disposed over the first device layer, the interlayer comprising a polymeric material;

a second device layer disposed over the interlayer, the second device layer comprising a second device component; and
an electrical interconnect having a first end and a second end, the electrical interconnect extending through a portion of the interlayer,
wherein the first end of the interconnect is in electrical communication with the first device component, and
wherein the second end of the interconnect is in electrical communication with the second device component.

2. The multilayer device of claim 1 , wherein the interlayer has a thickness from about 500 nm to 5 microns.

3. The multilayer device of claim 1 , wherein the interlayer has a thickness of less than or equal to about 5 microns.

4. The multilayer device of claim 1 , wherein the interlayer comprises a polyimide.

5. The multilayer device of claim 1 , wherein the first device component is spatially aligned with at least a portion of the second device component.

6. The multilayer device of claim 1 , further comprising an encapsulating layer, wherein the encapsulating layer at least partially encapsulates the second device layer.

7. The multilayer device of claim 6 , further comprising at least one first stretchable semiconductor structure in electrical communication with the first device component, wherein the second device layer further comprises at least one second stretchable semiconductor structure in electrical communication with the second device component.

8. The multilayer device of claim 7 , wherein the encapsulating layer at least partially encapsulates at least one of:
the second device component, and
the at least one second stretchable semiconductor structure.

9. The multilayer device of claim 6 , wherein the encapsulating layer comprises at least one of a polyimide and a polyurethane.

10. The multilayer device of claim 1 , wherein the flexible substrate comprises an elastomer.

11. The flexible multilayer device of claim 1 , further comprising at least one first stretchable semiconductor in electrical communication with the first device component, wherein the at least one first stretchable semiconductor structure is at least partially embedded in the intermediate layer.

12. The multilayer device of claim 1 , further comprising at least one first stretchable semiconductor in electrical communication with the first device component, wherein the at least one first stretchable semiconductor structure includes a plurality of stretchable semiconductor structures arranged in an array or pattern.

13. The multilayer device of claim 12 , wherein the pattern includes a grid configuration, a floral configuration, a bridge configuration, or any combination thereof.

14. The multilayer device of claim 1 , wherein at least one of the first device component and the second device component comprises a material selected from the group consisting of: single crystal silicon, Si, Ge, SiC, AlP, AlAs, AlSb, GaN, GaP, GaAs, GaSb, InP, InAs, InSb, ZnO, ZnSe, ZnTe, CdS, CdSe, CdTe, HgS, PbS, PbSe, PbTe, AlGaAs, AlInAs, AlInP, GaAsP, GaInAs, GaInP, AlGaAsSb, AlGaInP, SiGe, GaInAsP, and a carbon nanomaterial.

15. The multilayer device of claim 1 , wherein at least one of the first device component and the second device component comprises an optical device, an opto-electronic device, a microfluidic device, a microelectromechanical system, a nanoelectromechanical system, or any combination thereof.

16. The multilayer device of claim 1 , further comprising at least one first stretchable semiconductor in electrical communication with the first device component, wherein the at least one first stretchable semiconductor structure has a coiled conformation, a wrinkled conformation, a buckled conformation, or a wavy configuration.

17. The multilayer device of claim 1 , further comprising at least one first stretchable semiconductor in electrical communication with the first device component, wherein the at least one first stretchable semiconductor structure is in electrical communication with the first device component.

18. A multilayer device comprising:
a flexible substrate;
an intermediate layer that is supported on a surface of the flexible substrate;
a first device layer disposed over the flexible substrate and at least partially embedded in the intermediate layer, the first device layer comprising:
a first device component that forms part of a two-dimensional array;
at least two stretchable interconnects, each of the at least two stretchable interconnects having a first end, a second end, and a central portion that is between the first and the second end, wherein:
the at least two stretchable interconnects extend along at least two different directions from the first device component in a plane of the supporting surface to form the two dimensional array;
the first end of each of the at least two stretchable interconnects is in electrical communication with the first device component;

the central portion of each of the at least two stretchable interconnects comprises a bent configuration region; and
an interlayer disposed over the first device layer, the interlayer comprising a polymeric material;

a second device layer disposed over the interlayer, the second device layer comprising:
a second device component that forms part of a two-dimensional array;
at least two stretchable interconnects, each of the at least two stretchable interconnects having a first end, a second end, and a central portion that is between the first and the second end, wherein:
the at least two stretchable interconnects extend along at least two different directions from the second device component in a plane of the supporting surface to form the two dimensional array;
the first end of each of the at least two stretchable interconnects is in electrical communication with the second device component;

the central portion of each of the at least two stretchable interconnects comprises a bent configuration region; and

an electrical interconnect having a first end and the second end, the electrical interconnect extending through a portion of the interlayer,
wherein the first end of the interconnect is in electrical communication with the first device component, and
wherein the second end of the interconnect is in electrical communication with the second device component.

19. The multilayer device of claim 18 , further comprising an encapsulating layer, wherein the encapsulating layer at least pa

Assignees

• Univ Illinois

Inventors

• Rogers John A
• Meitl Matthew
• Sun Yugang
• Ko Heung Cho
• Carlson Andrew
• Choi Won Mook
• Stoykovich Mark
• Jiang Hanqing
• Huang Yonggang
• Nuzzo Ralph G
• Zhu Zhengtao
• Menard Etienne
• Khang Dahl-Young

Classifications

• H10P14/2922

  being non-crystalline insulating materials, e.g. glass or polymers · CPC title

• H10P14/265

  using solutions · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title