Gap-fill methods

US9324604B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9324604-B2
Application numberUS-201514755471-A
CountryUS
Kind codeB2
Filing dateJun 30, 2015
Priority dateJul 4, 2014
Publication dateApr 26, 2016
Grant dateApr 26, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are gap-fill methods. The methods comprise: (a) providing a semiconductor substrate having a relief image on a surface of the substrate, the relief image comprising a plurality of gaps to be filled, wherein the gaps have a width of 50 nm or less; (b) applying a gap-fill composition over the relief image, wherein the gap-fill composition comprises a first polymer comprising a crosslinkable group, a second polymer comprising a chromophore, wherein the first polymer and the second polymer are different, a crosslinker, an acid catalyst and a solvent, wherein the gap-fill composition is disposed in the gaps; (c) heating the gap-fill composition at a temperature to cause the first polymer to self-crosslink and/or to crosslink with the second polymer to form a crosslinked polymer; (d) forming a photoresist layer over the substrate comprising the crosslinked polymer-filled gaps; (e) patternwise exposing the photoresist layer to activating radiation; and (f) developing the photoresist layer to form a photoresist pattern. The methods find particular applicability in the manufacture of semiconductor devices for the filling of high aspect ratio gaps with an antireflective coating material.

First claim

Opening claim text (preview).

What is claimed is: 1. A gap-fill method, comprising: (a) providing a semiconductor substrate having a relief image on a surface of the substrate, the relief image comprising a plurality of gaps to be filled, wherein the gaps have a width of 50 nm or less; (b) applying a gap-fill composition over the relief image, wherein the gap-fill composition comprises a first polymer comprising a crosslinkable group, a second polymer comprising a chromophore, wherein the first polymer and the second polymer are different, a crosslinker, an acid catalyst, and a solvent, wherein the gap-fill composition is disposed in the gaps; (c) heating the gap-fill composition at a temperature to cause the first polymer to self-crosslink and/or to crosslink with the second polymer to form a crosslinked polymer; (d) forming a photoresist layer over the substrate comprising the crosslinked polymer-filled gaps; (e) patternwise exposing the photoresist layer to activating radiation; and (f) developing the photoresist layer to form a photoresist pattern. 2. The method of claim 1 , wherein the first polymer and/or the second polymer has a weight average molecular weight Mw of from 3000 to 6000. 3. The method of claim 1 , wherein the gaps have an aspect ratio of 2 or more. 4. The method of claim 1 , wherein the gaps have a width of 15 nm or less. 5. The method of claim 1 , wherein the crosslinkable group comprises a functional group independently chosen from hydroxyl, carboxyl, thiol, amine, epoxy, alkoxy, amide and vinyl. 6. The method of claim 1 , wherein the chromophore is chosen from optionally substituted benzyl, phenyl, naphthyl and anthracenyl. 7. The method of claim 1 , wherein the patternwise exposing is conducted at an exposure wavelength at 193 or 248. 8. The method of claim 1 , wherein the first polymer comprises a unit of the following general formula (I): wherein: R 1 is chosen from hydrogen, fluorine, C 1 -C 3 alkyl and C 1 -C 3 fluoroalkyl; and R 2 is chosen from: optionally substituted C 1 to C 12 linear, branched or cyclic alkyl; and optionally substituted C 6 to C 15 aryl (e.g. phenyl, napthyl, anthracenyl), optionally containing heteroatoms; wherein at least one hydrogen atom on R 1 and/or on R 2 is substituted with a crosslinkable functional group. 9. The method of claim 1 , wherein the first polymer comprises a unit of the following general formula (I): wherein R 3 is chosen from hydrogen, fluorine, C 1 -C 3 alkyl and C 1 -C 3 fluoroalkyl; and Ar 1 is an optionally substituted aryl group, wherein at least one hydrogen atom on R 3 and/or on Ar 1 is substituted with a crosslinkable functional group. 10. The method of claim 1 , wherein the weight ratio of the first polymer to the second polymer is from 2:1 to 4:1.

Assignees

Inventors

Classifications

  • Planarisation of organic insulating materials · CPC title

  • using an anti-reflective coating · CPC title

  • formed using trench refilling with dielectric materials, e.g. shallow trench isolations · CPC title

  • H10W10/014Primary

    using trench refilling with dielectric materials, e.g. shallow trench isolations · CPC title

  • Electricity · mapped topic

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What does patent US9324604B2 cover?
Provided are gap-fill methods. The methods comprise: (a) providing a semiconductor substrate having a relief image on a surface of the substrate, the relief image comprising a plurality of gaps to be filled, wherein the gaps have a width of 50 nm or less; (b) applying a gap-fill composition over the relief image, wherein the gap-fill composition comprises a first polymer comprising a crosslinka…
Who is the assignee on this patent?
Rohm & Haas Elect Mat, Rohm & Haas Elect Mat
What technology area does this patent fall under?
Primary CPC classification H10W10/014. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).