Method for microcontact printing

Patent metadata

Field	Value
Publication number	US-9323144-B2
Application number	US-201314439860-A
Country	US
Kind code	B2
Filing date	Dec 4, 2013
Priority date	Dec 10, 2012
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

A method for microcontact embossing of a structure by transferring an embossing material onto a target surface of a substrate by means of an embossing surface of a structural die. The embossing material is comprised at least predominantly of silane or at least predominantly of at least one silane derivative and in that the structural die is a soft die. A corresponding method is provided in which the embossing material is a molecular component that is comprised at least predominantly of organic molecules.

First claim

Having described the invention, the following is claimed:

1. A method for microcontact embossing a structure on a target surface of a substrate, the method comprising:
transferring an embossing material onto the target surface by means of an embossing surface of a structural die to emboss the structure on the target surface, the embossing material selected from the group consisting of silane, at least one silane derivative, and a molecular component of organic molecules, the structural die being a soft die and formed in a shape of a roller as a hollow shaft, the hollow shaft having a cavity in an interior thereof that is used as a reservoir for the embossing material, the structural die having a porous microstructure that consists of pores, the pores being arranged to pass the embossing material from the cavity to the embossing surface.

2. The method according to claim 1 , wherein the organic molecules are one or more selected from the group consisting of Enzymes, Alkaloids, Lipids, Hormones, Pheromones, Vitamins, Carbohydrates, Peptides, Nucleic acids, DNA or DNA strands, Cells, Proteins, Alkanes, Alkenes, Alkines, Aromatic compounds, and Graphene.

3. The method according to claim 1 , wherein the structural die has a modulus of elasticity between 10 −3 MPa and 100 MPa.

4. The method according to claim 1 , wherein the structural die is acid-resistant and/or base-resistant.

5. The method according to claim 1 , wherein the structural die consists essentially of an inert material.

6. Method-The method according to claim 1 , wherein the structural die is formed from a polymer, in particular PFPE or PDMS.

7. A method for embossing a structure onto a substrate, comprising the steps of:
providing a hollow cylindrical structural die having a soft, outer embossing surface arranged to emboss said structure onto a target surface of said substrate, said structural die having an inner cavity arranged to hold an embossing material, said structural die further having a porous microstructure having pores dimensioned to allow passage of said embossing material from said cavity to said embossing surface;
positioning said structural die against said target surface; and
embossing said structure formed of said embossing material onto said target surface, said embossing material being selected from the group consisting of a silane, a silane derivative, and a molecular component of organic molecules, said embossing comprising moving said substrate relative to said structural die such that said embossing surface travels over said target surface and forms said structure on said target surface.

8. A method of embossing a structure onto a substrate with an embossing surface formed on an outer surface of a soft roller die, the die having a rotational axis and a hollow shaft in which a cavity containing embossing material is arranged, said embossing material being selected from the group consisting of silane, at least one silane derivative, and a molecular component of organic compounds, the die further comprising a porous microstructure comprising pores dimensioned to permit diffusion of the embossing material supplied to the cavity when required by the embossing surface, the method comprising:
contacting the embossing surface to the target surface; and
embossing said structure on said target surface with said embossing material according to said embossing surface, said embossing comprising:
moving said substrate relative to said die to rotate said embossing surface around said rotational axis; and
transferring said embossing material from said embossing surface to said target surface by said moving of said substrate.

9. The method according to claim 8 , wherein the roller die consists of an inert material.

10. The method according to claim 8 , wherein the roller die is formed of PFPE.

11. The method according to claim 8 , wherein the roller die is formed of PDMS.

12. The method according to claim 8 , wherein the porous microstructure consists essentially of said pores.

13. The method according to claim 8 , wherein the passing of the embossing material from the cavity to the embossing surface is dependent on the ability of the embossing surface to absorb the embossing material.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Kreindl Gerald
• Wimplinger Markus
• Chouiki Mustapha

Classifications

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• G03F7/0015

  Production of aperture devices, microporous systems or stamps · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title