Semiconductor module assembly

Patent metadata

Field	Value
Publication number	US-9320147-B2
Application number	US-201313754906-A
Country	US
Kind code	B2
Filing date	Jan 31, 2013
Priority date	Jan 31, 2012
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A semiconductor module assembly is provided. The semiconductor module assembly includes a motherboard, a socket, and a semiconductor module. The motherboard includes an opening for receiving the semiconductor module, the opening including at least three sides. The socket is disposed in the opening along at least a first side, second side, and third side of the at least three sides. The semiconductor module is disposed in the socket. The semiconductor module includes at least one semiconductor device mounted on a module board. The socket includes at least a first side along the first side of the opening, and a second side along the second side of the opening, and the semiconductor module electrically connects to the motherboard through at least the first and second sides of the socket.

First claim

What is claimed is:

1. A semiconductor module assembly comprising:
a motherboard including an opening the opening including at least three sides; a socket disposed in the opening along at least a first side, a second side, and a third side of the at least three sides of the opening; and a semiconductor module disposed in the socket, the semiconductor module including at least one semiconductor device mounted on a module board, wherein: the socket includes at least a first socket side along the first side of the opening, and a second socket side along the second side of the opening, wherein each of the first socket side and the second socket side includes conductive lines, and the semiconductor module electrically connects to the motherboard through at least the conductive lines of the first socket side and the conductive lines of the second socket side, wherein the first socket side is perpendicular to the second socket side; wherein: the at least one semiconductor device is disposed in the opening, and at least part of the at least one semiconductor device is coplanar with at least part of the motherboard, wherein: a first portion of the socket is disposed above the motherboard and overlaps a portion of the motherboard; no portion of the socket is disposed below the motherboard where the socket overlaps the motherboard; a second portion of the socket is disposed below the module board and overlaps a portion of the module board; and no portion of the socket is disposed above the module board where the socket overlaps the module board.

2. The semiconductor module assembly of claim 1 , wherein:
the socket includes at least a third socket side along the third side of the opening; and
the semiconductor module also electrically connects to the motherboard through the third socket side of the socket.

3. The semiconductor module assembly of claim 1 , wherein:
a bottom surface of a first portion of the socket faces a top surface of the motherboard; and
a top surface of a second portion of the socket faces a bottom surface of the module board.

4. The semiconductor module assembly of claim 1 , wherein:
a thickness of the semiconductor module assembly is no greater than a combined thickness of the motherboard and the module board.

5. The semiconductor module assembly of claim 1 , wherein:
the socket includes an aligning key that aligns with aligning grooves on the module board.

6. The semiconductor module assembly of claim 5 , wherein:
the aligning key includes teeth portions on the first socket side, the second socket side, and the third socket side of the socket.

7. The semiconductor module assembly of claim 1 , wherein:
the module board includes a via hole including a conductive material disposed therein and exposed to the outside of the module board;
the socket includes a conductive line including a contact portion exposed at a top surface of a second portion of the socket; and
the conductive material contacts the contact portion of the conductive line.

8. The semiconductor module assembly of claim 1 , wherein:
the semiconductor module assembly is a memory module assembly;
the semiconductor module is a memory module;
the at least one semiconductor device includes a plurality of semiconductor memory packages; and
the plurality of semiconductor memory packages are in electrical communication with the motherboard through the socket and the module board.

9. A semiconductor module assembly comprising:
a motherboard including an opening for receiving a semiconductor module, the opening including at least three sides; a socket disposed in the opening along at least a first side, a second side, and a third side of the at least three sides, the socket having a first socket side corresponding to the first side of the opening, a second socket side corresponding to the second side of the opening, and a third socket side corresponding to the third side of the opening; and a semiconductor module disposed in the socket, the semiconductor module including at least one semiconductor device mounted on a module board and configured to make an electrical connection with the motherboard through at least the first socket side, the second socket side, and the third socket side, wherein: a first portion of the socket is disposed above the motherboard and vertically overlaps a portion of the motherboard; no portion of the socket is disposed below the motherboard where the socket vertically overlaps the motherboard; a second portion of the socket is disposed below the module board and vertically overlaps a portion of the module board; and no portion of the socket is disposed above the module board where the socket vertically overlaps the module board; and the at least one semiconductor device is disposed in the opening, wherein: at least part of the at least one semiconductor device is coplanar with at least part of the motherboard.

10. The semiconductor module assembly of claim 9 , wherein:
the semiconductor module electrically connects to the motherboard through at least two socket sides of the socket.

11. The semiconductor module assembly of claim 9 , wherein:
the socket includes an aligning key that aligns with aligning grooves on the module board.

12. The semiconductor module assembly of claim 11 , wherein:
the aligning key includes teeth portions on the first socket side, the second socket side, and the third socket side of the socket.

13. The semiconductor module assembly of claim 9 , wherein:
the module board includes a via hole including a conductive material disposed therein and exposed to the outside of the module board;
the socket includes a conductive line including a contact portion exposed at a top surface of a second portion of the socket;
the conductive material contacts the contact portion of the conductive line; and
part of the contact portion is disposed in the via hole.

14. The semiconductor module assembly of claim 9 , wherein:
the opening is a rectangular shape including four sides; and
the socket is disposed in the opening along the four sides.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cho Jeong-Hyeon
• Lee Jae-Jun
• Lee Jung-Joon
• Choi Baek Kyu
• Seo Seung-Jin

Classifications

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• H05K2203/166

  Alignment or registration; Control of registration · CPC title

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H05K1/141

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K2201/2018

  Presence of a frame in a printed circuit or printed circuit assembly · CPC title