Integrated circuit packaging system with magnetic film and method of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9318403-B2
Application number	US-201113211303-A
Country	US
Kind code	B2
Filing date	Aug 16, 2011
Priority date	Jun 25, 2007
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

An integrated circuit packaging system including: connecting a first integrated circuit device and a package substrate; attaching a support bump to the package substrate; providing a second integrated circuit device having an inner encapsulation; applying a magnetic film on the inner encapsulation of the second integrated circuit device; and mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump.

First claim

What is claimed is:

1. A method of manufacture of an integrated circuit packaging system comprising:
connecting a first integrated circuit device and a package substrate;
attaching a support bump to the package substrate;
providing a second integrated circuit device, larger than the first integrated circuit device, having an inner encapsulation;
applying a magnetic film on the inner encapsulation of the second integrated circuit device; and
mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump, a bottom surface of the magnetic film spaced away from the package substrate, the support bump penetrating the magnetic film to contact the inner encapsulation of the second integrated circuit device.

2. The method as claimed in claim 1 further comprising forming a package encapsulation on the first integrated circuit device, the magnetic film, and the second integrated circuit device.

3. The method as claimed in claim 1 wherein mounting the second integrated circuit device includes providing an integrated circuit die in the inner encapsulation.

4. The method as claimed in claim 1 wherein applying the magnetic film on the second integrated circuit device includes fully covering a non-active surface of the second integrated circuit device with the magnetic film.

5. The method as claimed in claim 1 wherein mounting the second integrated circuit device includes electrically connecting the second integrated circuit device with the package substrate.

6. A method of manufacture of an integrated circuit packaging system comprising:
connecting a first integrated circuit device having radio frequency circuitry therein and a package substrate;
attaching a support bump to the package substrate;
providing a second integrated circuit device, larger than the first integrated circuit device, includes:
providing an integrated circuit die connected to a carrier, and encapsulating with an inner encapsulation the integrated circuit die;

applying a magnetic film on the inner encapsulation of the second integrated circuit device;
mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump, a bottom surface of the magnetic film spaced away from the package substrate, the support bump penetrating the magnetic film to contact the inner encapsulation of the second integrated circuit device; and
forming a package encapsulation on the first integrated circuit device, the magnetic film, and the second integrated circuit device including forming the package encapsulation to fill a space between the bottom surface of the magnetic film and the package substrate.

7. The method as claimed in claim 6 wherein applying the magnetic film includes applying materials comprised of a magnetic particle and a polymer having inductive and resistive properties.

8. The method as claimed in claim 6 wherein applying the magnetic film includes applying an adhesive.

9. The method as claimed in claim 6 further comprising electrically connecting the support bump to ground.

10. The method as claimed in claim 6 wherein connecting the first integrated circuit device includes connecting a flip chip.

11. An integrated circuit packaging system comprising:
a package substrate;
a first integrated circuit device connected to the package substrate;
a support bump on the package substrate;
a magnetic film on the first integrated circuit device and the support bump, a bottom surface of the magnetic film spaced away from the package substrate;
a second integrated circuit device, larger than the first integrated circuit device, having an inner encapsulation on the magnetic film and the support bump penetrating the magnetic film to contact the inner encapsulation of the second integrated circuit device; and
a package encapsulation on the support bump, the first integrated circuit device, the magnetic film, and the second integrated circuit device including the package encapsulation filling a space between the bottom surface of the magnetic film and the package substrate.

12. The system as claimed in claim 11 wherein the second integrated circuit device includes an integrated circuit die in the inner encapsulation.

13. The system as claimed in claim 11 wherein the magnetic film fully covers a non-active surface of the second integrated circuit device.

14. The system as claimed in claim 11 wherein the second integrated circuit device is electrically connected with the package substrate.

15. The system as claimed in claim 11 wherein:
the first integrated circuit device includes radio frequency circuitry;
the magnetic film fully covers a non-active surface of the second integrated circuit device; and
the second integrated circuit device includes an integrated circuit die connected to a carrier.

16. The system as claimed in claim 15 wherein the magnetic film is comprised of a magnetic particle and a polymer having inductive and resistive properties.

17. The system as claimed in claim 15 wherein the magnetic film is an adhesive.

18. The system as claimed in claim 15 further comprising the support bump electrically connected to ground.

19. The system as claimed in claim 15 wherein the first integrated circuit device is a flip chip.

Assignees

• Kim Sung Soo
• Kim Dongsik
• Kwon Choonghwan
• Stats Chippac Ltd

Inventors

• Kim Sung Soo
• Kim Dongsik
• Kwon Choonghwan

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title