Substrate for preventing burr generation

Patent metadata

Field	Value
Publication number	US-9316768-B2
Application number	US-201414546298-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	Nov 20, 2013
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A substrate for an optical device includes an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces. A groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

First claim

What is claimed is:

1. A substrate for an optical device comprising an optical device substrate including a plurality of conductive plates elongated along a length direction, wherein side surfaces of the conductive plates are bonded to each other with insulators interposed therebetween, the insulators being respectively formed on the side surfaces,
wherein a groove having a predetermined depth for preventing burrs is formed in a lower surface of the optical device substrate at each point where a cutting line is crossed with one of the insulators when the optical device substrate is cut in a length direction and in a vertical direction, the groove being formed in such a way that said one of the insulators is exposed to an inside of the groove.

2. The substrate for an optical device according to claim 1 , wherein a liquid insulation material is deposited and cured inside the groove.

3. The substrate for an optical device according to claim 2 , wherein a photosensitive solder resist (PSR) is deposited on an area of the insulator exposed to the lower surface of the optical device substrate and on an area of the liquid insulating material exposed to the lower surface of the optical device substrate.

4. The substrate for an optical device according to claim 1 , wherein the groove is formed such that at least a part of the insulator exposed to the lower surface of the optical device substrate is accommodated inside the groove.

5. The substrate for an optical device according to claim 1 , wherein the groove has a larger diameter than a width of each insulator.

6. The substrate for an optical device according to claim 1 , wherein a solder resist is deposited on an upper surface and the lower surface of the optical device substrate so as to increase an optical reflectivity.

7. The substrate for an optical device according to claim 1 , wherein a cavity reaching downwardly to a predetermined depth from the upper surface of the optical device substrate is formed in the optical device substrate in such away that the insulator is exposed to a bottom surface of the cavity.

8. The substrate for an optical device according to claim 7 , further comprising an optical device chip mounted on the optical device substrate at an inside of the cavity.

Assignees

• Point Engineering Co Ltd

Inventors

• Ahn Bum Mo
• Nam Ki Myung
• Yoo Kyung Soo

Classifications

• H10H20/85

  Packages · CPC title

• H10H20/80 Primary

  Constructional details · CPC title

• B32B3/263

  characterised by a layer having non-uniform thickness · CPC title

• B32B2551/00

  Optical elements · CPC title

• B32B2307/202

  Conductive · CPC title