Solder handling assembly

Patent metadata

Field	Value
Publication number	US-9314863-B2
Application number	US-201213666745-A
Country	US
Kind code	B2
Filing date	Nov 1, 2012
Priority date	Nov 2, 2011
Publication date	Apr 19, 2016
Grant date	Apr 19, 2016

Abstract

A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.

First claim

What is claimed is:

1. A solder handling assembly comprising:
a heating portion;
a casing;
a variable resistor configured to change a temperature setting of the heating portion; and
a connecting member coupled to the variable resistor, the connecting member at least partially disposed within the casing, the connecting member rotatable about a rotational axis relative to the casing and configured to adjust the temperature setting by the variable resistor when the connecting member is rotated relative to casing,
wherein the connecting member includes an elastic-resilient member movable from a first state to a second state and further includes a first engagement device fixed on the elastic-resilient member, wherein the casing includes a plurality of first opposing engagement members, each first opposing engagement member fixed on the casing at a position different from that of the other first opposing engagement members,
wherein when the elastic-resilient member is in the first state, the first engagement device is engaged to any one of a plurality of the first opposing engagement members coupled to the casing, the engagement device prevents the first engagement device from rotating from the position of the first opposing engagement member to which the first engagement device is presently engaged, to another one of the plurality of positions, and prevents the connecting member from rotating about the rotational axis relative to the casing,
wherein when the elastic-resilient member is in the second state, the first engagement device is disengaged from the plurality of positions of the first opposing engagement members, the disengagement allows the first engagement device to rotate from the position of the first opposing engagement member to which the first engagement device was previously engaged, to another one of the plurality of positions, and allows the connecting member to rotate about the rotational axis relative to the casing,
wherein the elastic-resilient member is in the form of an arm radially extending from a central portion of the connecting member, and the first engagement device is fixed at an end of the arm,
wherein the connecting member includes a key receiving portion configured to receive, from outside the casing, a key projection having a shape that fits within the key receiving portion; and
an operating member, wherein the operating member includes the key projection configured to push the elastic-resilient member from the first state to the second state.

2. The solder handling assembly of claim 1 , wherein the second state of the elastic-resilient member corresponds to an elastically deformed state of the elastic-resilient member, and the first state of the elastic-resilient member corresponds to a free state of the elastic-resilient member before being elastically deformed.

3. The solder handling assembly of claim 1 , wherein the connecting member includes a boss, the key receiving portion is a slot in the boss, and the slot is configured to receive the key projection.

4. The solder handling assembly of claim 1 , wherein the casing forms a grip.

5. The solder handling assembly of claim 1 , wherein the first opposing engagement members are latch elements, the first engagement device is a lock element configured to individually engage the latch elements, and the latch elements correspond to different temperature settings of the heating portion.

6. The solder handling assembly of claim 5 , wherein the lock element is a projection, and each latch element is a recess configured to receive the projection.

7. The solder handling assembly of claim 1 , wherein the connecting member further includes a second engagement device, and the solder handling assembly further includes a second opposing engagement device coupled to the casing, wherein the second engagement device and the second opposing engagement device provide detents in rotation of the connecting member relative to the casing, and each detent is a change in rotating resistance in the rotation of the connecting member relative to the casing.

8. The solder handling assembly of claim 7 , wherein the second opposing engagement device includes a plurality of second latch elements, the second engagement device includes a second lock element configured to engage the second latch elements on an individual basis when the connecting member is rotated relative to the casing, and the second latch elements correspond to different temperature settings of the heating portion.

9. The solder handling assembly of claim 1 , wherein the operating member is configured to be attached to and removed from the connecting member.

10. The solder handling assembly of claim 1 , wherein the operating member is a knob attached to the connecting member, and the casing is disposed between a portion of the knob and a portion of the connecting member.

11. The solder handling assembly of claim 10 , wherein the knob is fixed at a state in which the key projection continually pushes the elastic-resilient member to the second state.

12. The solder handling assembly of claim 11 , further comprising a screw, wherein the screw fixes the knob at the state in which the key projection continually pushes the elastic-resilient member to the second state.

13. The solder handling assembly of claim 1 , wherein the plurality of positions are angular positions centered on the rotational axis of the connecting member.

Assignees

• Hakko Corp

Inventors

• Teraoka Yoshitomo

Classifications

• B23K3/033 Primary

  comprising means for controlling or selecting the temperature or power · CPC title