Overlap Joint Flex Circuit Board Interconnection
US-2024049392-A1 · Feb 8, 2024 · US
Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component
US9307643B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9307643-B2 |
| Application number | US-201414565763-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2014 |
| Priority date | Dec 10, 2013 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and multiple via conductors penetrating through the insulating layer and including a first via conductor reaching to the pattern on the substrate and a second via conductor reaching to the terminal of the component in the substrate. The pattern has a recessed connecting portion connected to the first via conductor, the terminal of the component has a recessed connecting portion connected to the second via conductor, and the recessed connecting portion of the pattern has depth which is greater than depth of the recessed connecting portion of the terminal.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate having a built-in electronic component, comprising: an insulating substrate having an opening portion; a conductor pattern formed on the insulating substrate; an electronic component accommodated in the opening portion of the insulating substrate and having a terminal; an insulating layer formed on the insulating substrate such that the insulating layer is covering the conductor pattern on the insulating substrate and the electronic compone…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9307643B2 cover?
- A substrate having a built-in electronic component includes an insulating substrate having an opening portion, a conductor pattern formed on the substrate, an electronic component accommodated in the opening portion of the substrate and having a terminal, an insulating layer formed on the substrate such that the insulating layer is covering the pattern and the component in the substrate, and mu…
- Who is the assignee on this patent?
- Ibiden Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/115. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).