Process and materials for making contained layers and devices made with same

Patent metadata

Field	Value
Publication number	US-9306185-B2
Application number	US-201314053120-A
Country	US
Kind code	B2
Filing date	Oct 14, 2013
Priority date	Jul 27, 2009
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

There is provided a process for forming a contained second layer over a first layer, including the steps:
forming the first layer having a first surface energy; treating the first layer with a priming layer; exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas; developing the priming layer to effectively remove the priming layer from either the exposed areas or the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and forming the second layer by liquid depositions on the pattern of priming layer on the first layer.

There is also provided an organic electronic device made by the process.

First claim

What is claimed is:

1. A process for forming a contained second layer over a first layer, said process comprising:
forming the first layer having a first surface energy;
treating the first layer with a priming layer;
exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas;
developing the priming layer to effectively remove the priming layer from either the exposed areas or the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and
forming the second layer by liquid deposition on the pattern of priming layer on the first layer.

2. The process of claim 1 , wherein the unexposed areas are removed.

3. The process of claim 1 , wherein developing is carried out by treating with a liquid.

4. The process of claim 1 , wherein developing is carried out by evaporation.

5. The process of claim 1 , wherein developing is carried out by contacting an outermost surface of the unexposed areas with an absorbent surface.

6. The process of claim 1 , wherein developing is carried out by contacting an outermost surface of the unexposed areas with an adhesive surface.

7. A process for making an organic electronic device comprising an electrode having positioned thereover a first organic active layer and a second organic active layer, said process comprising
forming the first organic active layer having a first surface energy over the electrode;
treating the first organic active layer with a priming layer;
exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas;
developing the priming layer to effectively remove the priming layer from either the exposed areas or the unexposed areas resulting in a first active organic layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and
forming the second organic active layer by liquid deposition on the pattern of priming layer on the first organic active layer.

8. The process of claim 7 , wherein the first active layer is a hole transport layer and the second active layer is a emissive layer.

9. The process of claim 7 , wherein the first active layer is a hole injection layer and the second active layer is a hole transport layer.

10. The process of claim 9 , wherein the hole injection layer comprises a conductive polymer and a fluorinated acid polymer.

11. The process of claim 9 , wherein the hole injection layer consists essentially of a conductive polymer doped with a fluorinated acid polymer and inorganic nanoparticles.

12. The process of claim 9 , wherein the priming layer comprises hole transport material.

13. The process of claim 9 , wherein the priming layer comprises a material selected from the group consisting of polymeric triarylamines, polycarbazoles, polyfluorenes, polymeric triarylamines having conjugated moieties which are connected in a non-planar configuration, copolymers of fluorene and triarylamine, metal quinolates, deuterated analogs thereof, and combinations thereof.

14. The process of claim 9 , wherein the hole transport layer is selected from the group consisting of polymeric triarylamines, polymeric triarylamines having conjugated moieties which are connected in a non-planar configuration, and copolymers of fluorene and triarylamines.

15. The process of claim 9 , further comprising forming an emissive layer by liquid deposition on the hole transport layer.

16. An organic electronic device comprising a first organic active layer and a second organic active layer positioned over an electrode, and further comprising a patterned priming layer between the first and second organic active layers, wherein said second organic active layer is present only in areas where the priming layer is present.

17. The device of claim 16 , wherein the first organic active layer is a hole transport layer and the second organic active layer is a emissive layer.

18. The device of claim 16 , wherein the first organic active layer is a hole injection layer and the second organic active layer is a hole transport layer.

19. The device of claim 18 , wherein the hole injection layer comprises a conductive polymer and a fluorinated acid polymer.

20. The device of claim 18 , wherein the hole injection layer consists essentially of a conjugated polymer doped with a fluorinated acid polymer and inorganic nanoparticles.

21. The device of claim 18 , wherein the priming layer consists essentially of a material selected from the group consisting of polymeric triarylamines, polycarbazoles, polyfluorenes, polymeric triarylamines having conjugated moieties which are connected in a non-planar configuration, copolymers of fluorene and triarylamine, metal quinolates, deuterated analogs thereof, and combinations thereof.

Assignees

• Du Pont

Inventors

• Fennimore Adam
• Ziebarth Jonathan M
• Radu Nora Sabina

Classifications

• H10K50/80

  Constructional details · CPC title

• H10K71/13 Primary

  using printing techniques, e.g. ink-jet printing or screen printing · CPC title

• B32B37/12

  characterised by using adhesives · CPC title

• B32B37/0084

  Point bonding · CPC title

• B32B37/0076

  characterised in that the layers are not bonded on the totality of their surfaces · CPC title