Methods of forming replacement fins for a finfet semiconductor device by performing a replacement growth process
US-2015024573-A1 · Jan 22, 2015 · US
US9306069B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9306069-B2 |
| Application number | US-201314024148-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 11, 2013 |
| Priority date | Sep 11, 2013 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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The disclosure relates to a fin field effect transistor (FinFET). An exemplary FinFET comprises a substrate comprising a major surface; a fin structure protruding from the major surface comprising a lower portion comprising a first semiconductor material having a first lattice constant; an upper portion comprising the first semiconductor material, wherein a bottom portion of the upper portion comprises a dopant with a first peak concentration; a middle portion between the lower portion and upper portion, wherein the middle portion comprises a second semiconductor material having a second lattice constant different from the first lattice constant; and an isolation structure surrounding the fin structure, wherein a portion of the isolation structure adjacent to the bottom portion of the upper portion comprises the dopant with a second peak concentration equal to or greater than the first peak concentration.
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What is claimed is: 1. A fin field effect transistor (FinFET) comprising: a substrate comprising a major surface; a fin structure protruding from the major surface, the fin structure comprising: a lower portion comprising a first semiconductor material having a first lattice constant; an upper portion comprising the first semiconductor material, wherein a bottom portion of the upper portion comprises a dopant with a first peak concentration; and a middle portion between the…
Electricity · mapped topic
Electricity · mapped topic
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