Backside Structure and Method for BSI Image Sensors
US-2015140722-A1 · May 21, 2015 · US
Backside structure and method for BSI image sensors
US9305966B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9305966-B2 |
| Application number | US-201514609066-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 29, 2015 |
| Priority date | May 10, 2012 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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Abstract
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BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectively removing the metal shield from over the sensor array region; selectively removing the first dielectric layer from over the sensor array region, wherein a portion of the first thickness of the BARC is also removed and a remainder of the first thickness of the BARC remains during the process of selectively removing the first dielectric layer; forming a second dielectric layer over the remainder of the BARC and over the metal shield; and forming a passivation layer over the second dielectric layer.
First claim
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What is claimed is: 1. A method of forming an image sensor, the method comprising: receiving a substrate having a sensor array region and a periphery region, the substrate having a front side surface and a back side surface; forming a plurality of metallization layers overlying the front side surface of the substrate; forming a bottom anti-reflective coating (BARC) layer over the back side surface of the substrate, the BARC layer having a first thickness over the sensor array…
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Cross-Sectional Technologies · mapped topic
Physics · mapped topic
- E05B41/00Primary
Fixed Constructions · mapped topic
Fixed Constructions · mapped topic
Electricity · mapped topic
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- What does patent US9305966B2 cover?
- BSI image sensors and methods. In an embodiment, a substrate is provided having a sensor array and a periphery region and having a front side and a back side surface; a bottom anti-reflective coating (BARC) is formed over the back side to a first thickness, over the sensor array region and the periphery region; forming a first dielectric layer over the BARC; a metal shield is formed; selectivel…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification E05B41/00. Mapped technology areas include Fixed Constructions.
- When was this patent published?
- Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).