Device and method for measuring dynamic thermal conductivity of micro-structure fluid

Patent metadata

Field	Value
Publication number	US-9304093-B2
Application number	US-201113814079-A
Country	US
Kind code	B2
Filing date	Aug 12, 2011
Priority date	Aug 12, 2010
Publication date	Apr 5, 2016
Grant date	Apr 5, 2016

Abstract

A device and method for measuring dynamic thermal conductivity of micro-structure fluid. The device includes an upper fixing plate ( 110 a ) and a lower fixing plate ( 110 b ) which are vertically spaced apart from each other, a lower body ( 150 b ) which defines a side surface of a separation space formed between the upper fixing plate and the lower fixing plate, a rotating plate ( 120 ) which is disposed in the separation space in such a way that gaps are respectively formed among the rotating plate and the upper and lower fixing plates, a shaft ( 140 ) which passes through the upper fixing plate and is coupled to the rotating plate, a heater which installed on an upper portion of the upper fixing plate, and thermocouples ( 118 a ) and ( 118 b ) which are respectively installed in the upper and lower fixing plates.

First claim

The invention claimed is:

1. A device for measuring dynamic thermal conductivity of micro-structure fluid, comprising:
an upper fixing plate and a lower fixing plate vertically spaced apart from each other;
a lower body defining a side surface of a separation space formed between the upper fixing plate and the lower fixing plate;
a rotating plate disposed in the separation space in such a way that gaps are respectively formed between the rotating plate and the upper fixing plate and between the rotating plate and the lower fixing plate;
a shaft passing through the upper fixing plate, the shaft being coupled to the rotating plate;
a heater installed on an upper portion of the upper fixing plate; and
a thermocouple installed in each of the upper and lower fixing plates,
wherein when the rotating plate is rotated, the micro-structure fluid loaded in the separation space is under a dynamic state, and then the thermocouples measure a temperature difference of the micro-structure fluid which is caused by a constant heat flux applied by the heater, thus calculating the dynamic thermal conductivity of the micro-structure fluid.

2. The device for measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 1 , further comprising a cooling thermoelement under a lower surface of the lower fixing plate.

3. The device for measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 2 , wherein each of the upper fixing plate, the lower fixing plate and the rotating plate is made of copper coated with a corrosion resistant film.

4. The device for measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 3 , wherein a thickness of the corrosion resistant film is 100 μm or less.

5. The device for measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 4 , wherein a flange is provided on an inner side surface of the lower body, and the upper fixing plate and the lower fixing plate are respectively coupled to upper and lower surface of the flange.

6. The device for measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 1 , wherein a radius of the separation space ranges from 20 mm to 200 mm, and the gap between the upper fixing plate and the rotating plate and the gap between the lower fixing plate and the rotating plate range from 0.1 mm to 1.0 mm.

7. A method of measuring dynamic thermal conductivity of micro-structure fluid using the device according to claim 1 , the method comprising:
filling the separation space with the micro-structure fluid;
operating the heater and generating a temperature difference between the upper fixing plate and the lower fixing plate;
rotating the rotating plate so that the micro-structure fluid is under a dynamic state; and
measuring the thermal conductivity using temperatures measured by the thermocouples.

8. The method of measuring the dynamic thermal conductivity of the micro-structure fluid according to claim 7 , wherein an rpm of the rotating plate ranges from 0.1 rpm to 100 rpm.

Assignees

• Lee Wook-Hyun
• Park Seong-Ryong
• Kim Chong-Youp
• Kim Seok-Won
• Korea Energy Research Inst

Inventors

• Lee Wook-Hyun
• Park Seong-Ryong
• Kim Chong-Youp
• Kim Seok-Won

Classifications

• G01N25/18 Primary

  by investigating thermal conductivity (by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18) · CPC title