Component rework nozzle

US9302277B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9302277-B2
Application numberUS-201213539076-A
CountryUS
Kind codeB2
Filing dateJun 29, 2012
Priority dateJun 29, 2012
Publication dateApr 5, 2016
Grant dateApr 5, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for a component rework nozzle includes a nozzle with a proximal end spaced apart from a distal end along an axis. The proximal end is sized to partially enclose a component during a component rework process. The component is disposed on a substrate by way of a plurality of solder joints. The apparatus includes an indentation defined in a side of the nozzle. The side of the nozzle is parallel to the axis. The indentation is shaped to maintain a separation between the nozzle and a neighboring component. The neighboring component is disposed adjacent to the component on the substrate. The apparatus includes a plurality of notches disposed on the proximal end of the nozzle. The plurality of notches are formed to balance heat distribution, during the component rework process, across the component.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus comprising: a nozzle with a proximal end spaced apart from a distal end along an axis, the proximal end sized to partially enclose a component during a component rework process, the component disposed on a substrate by way of a plurality of solder joints; an indentation defined in a side of the nozzle, the side of the nozzle parallel to the axis, the indentation shaped to maintain a separation between the nozzle and a neighboring component, th…

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What does patent US9302277B2 cover?
An apparatus for a component rework nozzle includes a nozzle with a proximal end spaced apart from a distal end along an axis. The proximal end is sized to partially enclose a component during a component rework process. The component is disposed on a substrate by way of a plurality of solder joints. The apparatus includes an indentation defined in a side of the nozzle. The side of the nozzle i…
Who is the assignee on this patent?
Davis Jr Willie T, Huang Michk, Pymento Larry G, and 2 more
What technology area does this patent fall under?
Primary CPC classification B23K1/018. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).