Apparatus of mounting and removing component, method of mounting component and method of removing component
US-9517520-B2 · Dec 13, 2016 · US
Removing material from defective opening in glass mold
US9254533B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9254533-B2 |
| Application number | US-201213491093-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 7, 2012 |
| Priority date | Jan 16, 2008 |
| Publication date | Feb 9, 2016 |
| Grant date | Feb 9, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: providing a glass mold including a plurality of solder filled openings, wherein the plurality of solder filled openings includes greater than one million openings; identifying a defective opening in the glass mold; ejecting material from the defective opening by applying a laser pulse, with an output wavelength of approximately 308 nm, to the defective opening; and repairing the defective opening by filling the defective opening wi…
Assignees
Inventors
Classifications
- B23K1/018Primary
Operations & Transport · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9254533B2 cover?
- Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by a…
- Who is the assignee on this patent?
- Cohen Jerome D, Haas Robert G, Herz Enrico, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification B23K1/018. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 09 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).