Attachment devices and methods for light emitting devices

Patent metadata

Field	Value
Publication number	US-9300062-B2
Application number	US-201113282172-A
Country	US
Kind code	B2
Filing date	Oct 26, 2011
Priority date	Nov 22, 2010
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.

First claim

What is claimed is:

1. A light emitting device comprising:
a submount;
a light emission area comprising a plurality of light emitting diode (LED) chips, disposed over the submount; and
at least one attachment member provided on the submount for engaging an electrical component and providing a solder free connection between the electrical component and the attachment member, wherein the attachment member is configured to displace a portion of the electrical component, and wherein each LED chip and the attachment member are disposed on a same surface of the submount.

2. The light emitting device of claim 1 , wherein the attachment member comprises an insulated housing and one or more openings within the housing for receiving the electrical component.

3. The light emitting device of claim 2 , wherein the openings comprise a grip member for physically securing the electrical component within the attachment member.

4. The light emitting device of claim 3 , wherein electrical component comprises an electrical wire with a diameter ranging from 0.13 to 2.08 square millimeters (mm 2 ).

5. The light emitting device of claim 1 , wherein electrical component comprises an electrical wire with a diameter ranging from 0.13 to 2.08 square millimeters (mm 2 ).

6. The light emitting device of claim 1 , wherein the plurality of LED chips is disposed under a filling material.

7. The light emitting device of claim 1 , wherein a retention material is provided about the light emission area.

8. The light emitting device of claim 7 , wherein the retention material is dispensed about the light emission area.

9. The light emitting device of claim 1 , wherein the attachment member is adapted to physically and electrically connect the electrical component to the submount.

10. The device of claim 1 , wherein the attachment member comprises an insulation displacement connector (IDC) having at least one set of blade portions for electrically communicating with electrical component.

11. The device of claim 10 , wherein the IDC comprises a double contact connector having more than one set of blade portions.

12. The device of claim 1 , wherein the attachment member comprises an insulated housing with one or more pins extending from housing.

13. The device of claim 12 , wherein the pins are configured to physically and electrically connect to a female terminal of electrical component thereby providing the solder free connection.

14. The device of claim 1 , wherein the attachment member physically and electrically connects to submount via solder, adhesive, or electrically conductive tape.

15. The device of claim 1 , wherein the attachment member comprises a first channel for crimping about a bare portion of electrical component.

16. The device of claim 15 , wherein the attachment member comprises a second channel for crimping about an insulated portion of electrical component.

17. A method of providing external electrical current to a light emitting device, the method comprising:
providing the light emitting device, the device comprising:
a submount;
a light emission area comprising a plurality of light emitting diode (LED) chips disposed over the submount; and
at least one attachment member on the submount, wherein the attachment member releasably engages an electrical component thereby providing a solder free connection between the attachment member and the electrical component, wherein each LED chip and the attachment member are disposed on a same surface of the submount;

positioning the electrical component into the attachment member of the device; and
displacing a portion of the electrical component to physically and electrically connect the electrical component to the device.

18. The method of claim 17 , wherein attaching the electrical component comprises inserting the electrical component into an opening of a housing of the attachment member to physically and electrically connect the electrical component to the device.

19. The method of claim 17 , further comprising releasing the electrical component from the attachment member to physically and electrically disconnect the electrical component from the device.

20. The method of claim 19 , wherein releasing the electrical component comprises depressing a tab of the attachment member to physically and electrically disengage the electrical component from the attachment member.

21. The method of claim 17 , wherein attaching the electrical component comprises positioning the electrical component between at least one set of blade portions of an insulation displacement connector (IDC).

22. The method of claim 21 , wherein attaching the electrical component comprises positioning the electrical component between at least two set of blade portions of the IDC.

23. The method of claim 17 , wherein attaching the electrical component comprises inserting one or more pins extending from a housing of the attachment member into a female terminal of an external housing.

24. The method of claim 23 , wherein the pins are configured to physically and electrically connect to the female terminal of electrical component.

25. The method of claim 17 , further comprising electrically and physically connecting the attachment member to the submount via soldering.

26. The method of claim 17 , wherein attaching the electrical component comprises crimping a bare portion of the electrical component in a first channel.

27. The device of claim 26 , wherein attaching the electrical component further comprises crimping an insulated portion of the electrical component in a second channel.

28. A light emitting device comprising:
a submount;
a plurality of light emitting diode (LED) chips disposed on the submount; and
at least one attachment member attached to the submount, the attachment member comprising a housing for receiving and displacing a portion of an electrical connector and for maintaining the electrical connector a distance spaced apart from the submount, wherein each LED chip and the attachment member are disposed on a same surface of the submount.

29. The light emitting device of claim 28 , wherein the plurality of LED chips is at least partially disposed under a filling material.

30. The light emitting device of claim 28 , further comprising a retention material disposed about at least a portion of the plurality of LED chips.

31. The light emitting device of claim 30 , wherein the retention material comprises a dispensed retention material on the submount.

32. The light emitting device of claim 29 , wherein the filling material comprises an encapsulant having at least one phosphor.

33. The light emitting device of claim 28 , wherein the attachment member comprises a central body portion disposed between one or more raised portions.

34. The light emitting device of claim 33 , wherein the one or more raised portions comprise an attachment portion spaced apart the distance from the submount for electrically connecting to at least a portion of an electrical wire.

35. The light emitting device of claim 33 , wherein the central body portion comprises an attachment portion spaced apart the distance from the submount for electrically connecting to at least a portion of an electrical wire.

36. The light

Assignees

• Hussell Christopher P
• Wilcox Kurt S
• Andrews Peter Scott
• Reiherzer Jesse Colin
• Cree Inc

Inventors

• Hussell Christopher P
• Wilcox Kurt S
• Andrews Peter Scott
• Reiherzer Jesse Colin

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title