Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
US8994057B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994057-B2 |
| Application number | US-201314052201-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 11, 2013 |
| Priority date | Feb 16, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Official abstract text for this publication.
Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a submount and a light emission area disposed over the submount. The light emission area can include one or more light emitting diodes (LEDs), a fillet at least partially disposed about the one or more the LEDs, and filling material. The filling material can be disposed over a portion of the one or more LEDs and a portion of the fillet.
Opening claim text (preview).
What is claimed is: 1. A light emitting device, comprising: a submount comprising at least one of a dielectric layer, a core layer, a solder mask layer and one or more reflection layer; a light emission area disposed over the submount, wherein the light emission area comprises at least one light emitting diode (LED); and a fillet at least partially disposed about the light emission area, wherein the fillet comprises a substantially horizontal surface disposed against the refle…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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