Plasma processing apparatus
US-2024420923-A1 · Dec 19, 2024 · US
Method and apparatus for measuring wafer bias potential
US9299539B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9299539-B2 |
| Application number | US-54529309-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 21, 2009 |
| Priority date | Aug 21, 2009 |
| Publication date | Mar 29, 2016 |
| Grant date | Mar 29, 2016 |
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Abstract
Official abstract text for this publication.
A device for use in a wafer processing chamber having a plasma forming volume and a hot edge ring. The hot edge ring has a first surface and a second surface. The first surface is in contact with the plasma forming volume. The second surface is not in contact with the plasma forming volume. The device includes a detector operable to contact the second surface of the hot edge ring. The detector can detect a parameter of the hot edge ring and can provide a detected signal based on the detected parameter.
First claim
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What is claimed as new and desired to be protected by Letters Patent of the United States is: 1. A device for use in a wafer processing chamber having a plasma forming volume, a hot edge ring, the hot edge ring having a first surface and a second surface, the first surface being in contact with the plasma forming volume, the second surface not being in contact with the plasma forming volume, said device comprising: a detector separated from the plasma forming volume by the hot edg…
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Classifications
Electricity · mapped topic
- H01J37/32642Primary
Electricity · mapped topic
Electricity · mapped topic
- H10P74/203Primary
Electricity · mapped topic
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- What does patent US9299539B2 cover?
- A device for use in a wafer processing chamber having a plasma forming volume and a hot edge ring. The hot edge ring has a first surface and a second surface. The first surface is in contact with the plasma forming volume. The second surface is not in contact with the plasma forming volume. The device includes a detector operable to contact the second surface of the hot edge ring. The detector …
- Who is the assignee on this patent?
- Makhratchev Konstantin, Valcore John, Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H01J37/32642. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).