Metal dewetting methods and articles produced thereby

US9296183B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9296183-B2
Application numberUS-201213687208-A
CountryUS
Kind codeB2
Filing dateNov 28, 2012
Priority dateNov 30, 2011
Publication dateMar 29, 2016
Grant dateMar 29, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A patterned article, comprising: a substrate; a continuous ultra-thin metal-containing film or film stack disposed on a surface of the substrate; and a plurality of discrete dewetted metal-containing islands disposed on a surface of the continuous ultra-thin metal-containing film or film stack; wherein the plurality of discrete metal-containing dewetted islands have an average height of about 5 nanometers to about 300 nanometers, an average longest lateral cross-sectional dimension of about 10 nanometers to about 1000 nanometers, and are randomly oriented on the surface of the continuous ultra-thin metal-containing film or film stack so as to cover less than or equal to about 0.5 of an area fraction of the surface of the continuous ultra-thin metal-containing film or film stack. 2. The patterned article of claim 1 , wherein the continuous ultra-thin metal-containing film or film stack has an average thickness of less than or equal to about 5 nanometers. 3. The patterned article of claim 1 , wherein the substrate has an average thickness of about 0.02 millimeters to about 2 millimeters. 4. The patterned article of claim 1 , wherein the plurality of discrete dewetted metal-containing islands comprise a metal in its elemental form or a metal that is a constituent of an alloy. 5. The patterned article of claim 1 , wherein the average height of the plurality of discrete metal-containing dewetted islands is about 20 nanometers to about 100 nanometers. 6. The patterned article of claim 1 , wherein the average longest lateral cross-sectional dimension of the plurality of discrete metal-containing dewetted islands is about 30 nanometers to about 200 nanometers. 7. The patterned article of claim 1 , wherein the area fraction covered by the plurality of discrete metal-containing dewetted islands is less than or equal to about 0.25 of the surface of the continuous ultra-thin metal-containing film or film stack. 8. The patterned article of claim 1 , wherein the patterned article is at least a portion of an anti-reflection coating, a metal mask, a localized surface plasmon resonance structure, a catalyst, a catalyst support, an anti-virus coating, or an antibacterial coating. 9. A patterned article, comprising a strengthened alkali aluminosilicate glass substrate; a continuous ultra-thin metal-containing film or film stack disposed on a surface of the strengthened alkali aluminosilicate glass substrate, wherein the continuous ultra-thin metal-containing film or film stack has an average thickness of less than or equal to about 5 nanometers; and a plurality of discrete dewetted metal-containing islands disposed on a surface of the continuous ultra-thin metal-containing film or film stack; wherein the plurality of discrete metal-containing dewetted islands have an average height of about less than or equal to about 130 nanometers, an average longest lateral cross-sectional dimension of about 50 nanometers to about 200 nanometers, and are randomly oriented on the surface of the continuous ultra-thin metal-containing film or film stack so as to cover less than or equal to about 0.1 of an area fraction of the surface of the continuous ultra-thin metal-containing film or film stack. 10. The patterned article of claim 9 , wherein the plurality of discrete dewetted metal-containing islands comprise a metal in its elemental form or a metal that is a constituent of an alloy.

Assignees

Inventors

Classifications

  • C23C14/185Primary

    by cathodic sputtering · CPC title

  • Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

  • Thermal treatment · CPC title

  • with metals (C03C17/34, C03C17/44 take precedence) · CPC title

  • B05D3/007Primary

    After-treatment · CPC title

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What does patent US9296183B2 cover?
Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack dis…
Who is the assignee on this patent?
Baker David Eugene, Carbonell Carme Gomez, Dawson-Elli David Francis, and 4 more
What technology area does this patent fall under?
Primary CPC classification C23C14/185. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).