Semiconductor device and manufacturing method

Patent metadata

Field	Value
Publication number	US-9287377-B2
Application number	US-201414450387-A
Country	US
Kind code	B2
Filing date	Aug 4, 2014
Priority date	Aug 4, 2014
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

A semiconductor device includes a trench extending into a semiconductor body from a first surface. At least one of a ternary carbide and a ternary nitride is in the trench.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a trench extending into a semiconductor body from a first surface; and
at least one of a ternary carbide and a ternary nitride in the trench,
wherein the at least one of the ternary carbide and the ternary nitride fills the trench completely.

2. The semiconductor device of claim 1 , wherein the at least one of the ternary carbide and the ternary nitride is A x B y R z , wherein A is one of Sc, Ti, Cr, V, Zr, Nb, Mo, Hf, and Ta, wherein B is one of Al, Si, P, S, Ga, Ge, As, Cd, In, Sn, Te, and Pb, wherein R is one of C and N, and wherein [x,y,z] is one of [2,1,1], [3,1,2], [4,1,3].

3. The semiconductor device of claim 1 , further comprising a dielectric between the at least one of the ternary carbide and the semiconductor body.

4. The semiconductor device of claim 1 , wherein the trench is a contact trench including the at least one of the ternary carbide and the ternary nitride as a conductive filling electrically coupled to the semiconductor body.

5. The semiconductor device of claim 4 , further comprising a contact layer comprising at least one of a silicide and a highly doped semiconductor material between the at least one of the ternary carbide and the ternary nitride and the semiconductor body.

6. A semiconductor device, comprising:
a semiconductor body having opposite first and second surfaces; and
at least one of a nitride and a carbide buried in the semiconductor body, wherein a second part of the semiconductor body is between the first surface and the at least one of the nitride and the carbide, and a first part of the semiconductor body is between the second surface and the at least one of the nitride and the carbide,
wherein a melting point of the at least one of the nitride and the carbide is greater than 900° C.

7. The semiconductor device of claim 6 , wherein the
at least one of the carbide and the nitride is a binary or a ternary compound.

8. The semiconductor device of claim 6 , wherein the at least one of the carbide and the nitride is A x B y R z , wherein A is one of Sc, Ti, Cr, V, Zr, Nb, Mo, Hf, and Ta, wherein B is one of Al, Si, P, S, Ga, Ge, As, Cd, In, Sn, Te, and Pb, wherein R is one of C and N, and wherein [x,y,z] is one of [2,1,1], [3,1,2], [4,1,3].

9. The semiconductor device of claim 6 , wherein an electrical conductivity of the at least one of the carbide and the nitride is greater than 3×10 6 S/m.

10. The semiconductor device of claim 9 , further comprising an electric wiring buried in the semiconductor body, the electric wiring comprising the at least one of the carbide and the nitride.

11. The semiconductor device of claim 10 , further comprising at least one of a contact layer and a dielectric between the electric wiring and the semiconductor body.

12. The semiconductor device of claim 6 , wherein the
at least one of the carbide and the nitride is a recombination structure arranged vertically between a highly doped emitter region at the first surface and a drift zone.

13. The semiconductor device of claim 6 , wherein the
at least one of the carbide and the nitride is a recombination structure arranged laterally between a first active area of a first semiconductor element and a second active area of a second semiconductor element.

14. The semiconductor device of claim 6 , wherein the
at least one of the carbide and the nitride is a recombination structure arranged laterally in a transition area between a transistor cell array and a junction termination area.

15. A method of manufacturing a semiconductor device, the method comprising:
forming at least one of a nitride and a carbide on a first part of a semiconductor body; and
burying the at least one of the nitride and the carbide in the semiconductor body by forming a second part of the semiconductor body on the first part and on the at least one of the nitride and the carbide by epitaxial growth.

16. The method of claim 15 , wherein the second part is formed by selective epitaxial growth or epitaxial lateral overgrowth.

17. The method of claim 15 , wherein an electrical conductivity of the at least one of the carbide and the nitride is greater than 3×10 6 S/m.

18. The method of claim 17 , further comprising etching a trench into the semiconductor body from a surface of the second part up to the at least one of the nitride and the carbide.

19. The method of claim 15 , wherein the at least one of the carbide and the nitride is A x B y R z , wherein A is one of Sc, Ti, Cr, V, Zr, Nb, Mo, Hf, and Ta, wherein B is one of Al, Si, P, S, Ga, and Ge, wherein R is one of C and N, and wherein [x,y,z] is one of [2,1,1], [3,1,2], [4,1,3].

20. A semiconductor device, comprising:
a trench extending into a semiconductor body from a first surface;
at least one of a ternary carbide and a ternary nitride in the trench, wherein the trench is a contact trench including the at least one of the ternary carbide and the ternary nitride as a conductive filling electrically coupled to the semiconductor body; and
a contact layer comprising at least one of a silicide and a highly doped semiconductor material between the at least one of the ternary carbide and the ternary nitride and the semiconductor body.

Assignees

• Infineon Technologies Ag

Inventors

• Glaser Ulrich
• Irsigler Peter
• Schulze Hans-Joachim

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P14/276

  Lateral overgrowth · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• H10W20/021

  of interconnections within wafers or substrates · CPC title

• H10W20/20

  Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] · CPC title