Systems and method for transferring a semiconductor substrate

Patent metadata

Field	Value
Publication number	US-9287151-B2
Application number	US-201414152323-A
Country	US
Kind code	B2
Filing date	Jan 10, 2014
Priority date	Jan 10, 2014
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

In accordance with some embodiments, systems and methods for processing a semiconductor substrate are provided. The method includes loading a semiconductor substrate from a chamber to a transfer module, detecting a center and a notch of the semiconductor substrate by the transfer module, and transferring the semiconductor substrate from the transfer module to a process chamber.

First claim

What is claimed is:

1. A method for processing a semiconductor substrate, comprising:
loading a semiconductor substrate from a chamber to a transfer module, the transfer module having a stage and a carrier, the carrier being connected to the stage and movable with respect to the stage along a first direction, the carrier having at least one groove formed therethrough;
detecting a center and a notch of the semiconductor substrate by the transfer module, wherein at least one of the center and the notch detecting is performed through the at least one groove in the carrier; and
transferring the semiconductor substrate from the transfer module to a process chamber.

2. The method as claimed in claim 1 , wherein the operation of loading the semiconductor substrate comprises:
raising a movable pillar in the chamber to hold the semiconductor substrate;
moving the carrier of the transfer module into the chamber and under the semiconductor substrate;
lowering the movable pillar in the chamber; and
moving back the carrier of the transfer module.

3. The method as claimed in claim 1 , wherein the operation of detecting the center and the notch of the semiconductor substrate comprises:
detecting the center of the semiconductor substrate by a center detector of the transfer module;
rotating the semiconductor substrate by a rotating member of the transfer module after extending the rotating member through the at least one groove of the carrier; and
detecting the notch of the semiconductor substrate by a notch detector of the transfer module.

4. The method as claimed in claim 1 , wherein the operation of transferring the semiconductor substrate comprises:
rotating a stage of the transfer module; and
moving a carrier of the transfer module into the process chamber;
raising a movable pillar in the process chamber to hold the semiconductor substrate;
moving back the carrier of the transfer module; and
lowering the movable pillar with the semiconductor substrate in the process chamber.

5. The method as claimed in claim 1 , further comprising:
processing the semiconductor substrate in the process chamber.

6. The method as claimed in claim 1 , further comprising:
transferring the semiconductor substrate from the process chamber to the transfer module; and
cooling the semiconductor substrate by the transfer module.

7. The method as claimed in claim 6 , wherein the operation of cooling the semiconductor substrate comprises:
lowering the carrier of the transfer module to place the semiconductor substrate on a cooling member of the transfer module; and
cooling the semiconductor substrate by the transfer module.

8. The method as claimed in claim 1 , further comprising:
transferring the semiconductor substrate from the process chamber to the transfer module; and
transferring the semiconductor substrate from the transfer module to a second process chamber.

9. A transfer module for transferring a semiconductor substrate, comprising:
a stage;
a carrier, connected to the stage and movable with respect to the stage along a first direction, the carrier having at least one groove formed therethrough;
a rotating member, connected to the stage and being aligned with the at least one groove of the carrier, the rotating member being movable between a retracted positon and an extended position such that, in the extended position, the rotating member extends through the at least one groove of the carrier with a distal end of the rotating member protruding beyond an upper surface of the carrier to contact a semiconductor substrate carried by the carrier for rotating the semiconductor substrate;
a center detector, connected to the stage and configured to detect a center of the semiconductor substrate; and
a notch detector, connected to the stage and configured to detect a notch of the semiconductor substrate.

10. The transfer module as claimed in claim 9 , further comprising:
a cooling member, disposed on the stage and configured to cool the semiconductor substrate.

11. The transfer module as claimed in claim 10 , wherein the carrier comprises a first portion and a second portion, and the first portion is connected to the second portion and movable with respect to the second portion along a second direction substantially perpendicular to the first direction.

12. The transfer module as claimed in claim 11 , wherein the thickness of the cooling member exceeds that of the first portion.

13. The transfer module as claimed in claim 11 , wherein the first portion is extended along the second direction.

14. The transfer module as claimed in claim 9 , further comprising:
a plurality of cooling members, disposed on opposite sides of the carrier and configured to cool the semiconductor substrate.

15. The transfer module as claimed in claim 9 , wherein the carrier is positioned between the center detector and the stage.

16. The transfer module as claimed in claim 9 , wherein the notch detector is positioned in the stage and aligned with the at least one groove of the carrier.

17. The transfer module as claimed in claim 9 , wherein the carrier is positioned between the notch detector and the stage.

18. A system for transferring a semiconductor substrate, comprising:
a storage chamber;
a first process chamber;
a station, connected to the storage chamber and the first process chamber; and
a transfer module, positioned in the station, comprising:
a stage;
a carrier, connected to the stage and movable with respect to the stage along a first direction, the carrier having at least one groove formed therethrough;
a rotating member, connected to the stage;
a center detector, connected to the stage for detecting a center of the semiconductor substrate; and
a notch detector, connected to the stage and aligned with the at least one groove of the carrier for detecting a notch of the semiconductor substrate through the at least one groove of the carrier.

19. The system as claimed in claim 18 , wherein the first chamber comprises a movable pillar for sustaining the semiconductor substrate.

20. The system as claimed in claim 18 , further comprising:
a second process chamber, connected to the station.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Ping-Yuan
• Ni Chyi-Tsong
• Cheng Wen-Kung
• Huang Huai-Te

Classifications

• H10P72/0434

  mainly by convection · CPC title

• H10P72/53

  using optical controlling means · CPC title

• H10P72/3302 Primary

  Mechanical parts of transfer devices · CPC title

• H01L21/67742 Primary

  Electricity · mapped topic

• H01L21/67109

  Electricity · mapped topic